XCF02SVOG20C0936 vs XC17V01SOG20C feature comparison

XCF02SVOG20C0936 AMD Xilinx

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XC17V01SOG20C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code TSSOP SOIC
Package Description LEAD FREE, PLASTIC, TSSOP-20 SOP,
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.B.1 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e3 e3
Length 6.5024 mm 12.8 mm
Memory Density 2097152 bit 1048576 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX1 1MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.19 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 7.5 mm
Base Number Matches 1 1

Compare XCF02SVOG20C0936 with alternatives

Compare XC17V01SOG20C with alternatives