XOMAP3525BCUS vs AM3715CUSD100 feature comparison

XOMAP3525BCUS Texas Instruments

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AM3715CUSD100 Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description VFBGA, BGA423,24X24,25 14 X 14 MM, 0.65 MM PITCH, GREEN, PLASTIC, BGA-423
Pin Count 423 423
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26
Boundary Scan YES YES
Clock Frequency-Max 19.2 MHz 54 MHz
External Data Bus Width 16
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B423 S-PBGA-B423
Length 14 mm 16 mm
Low Power Mode YES YES
Number of Terminals 423 423
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA LFBGA
Package Equivalence Code BGA423,24X24,25 BGA423,24X24,25
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.4 mm
Speed 600 MHz 1000 MHz
Supply Voltage-Max 1.89 V 1.2 V
Supply Voltage-Min 1.71 V 0.9 V
Supply Voltage-Nom 1.8 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 16 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
ECCN Code 5A992.C
Bit Size 32
JESD-609 Code e1
Moisture Sensitivity Level 3
On Chip Data RAM Width 8
Operating Temperature-Max 90 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
RAM (words) 65536
Supply Current-Max 900 mA
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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