XPC7455RX733LC
vs
MC7457VG1200LC
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA483,22X22,50
|
29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-483
|
| Pin Count |
483
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
36
|
36
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
167 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-B483
|
S-CBGA-B483
|
| JESD-609 Code |
e0
|
|
| Length |
29 mm
|
29 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
483
|
483
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA483,22X22,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.22 mm
|
3.2 mm
|
| Speed |
733 MHz
|
1200 MHz
|
| Supply Voltage-Max |
1.65 V
|
1.35 V
|
| Supply Voltage-Min |
1.55 V
|
1.25 V
|
| Supply Voltage-Nom |
1.6 V
|
1.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XPC7455RX733LC with alternatives
Compare MC7457VG1200LC with alternatives