Z8018008GMB vs Z8018033PSC feature comparison

Z8018008GMB IXYS Corporation

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Z8018033PSC Zilog Inc

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer IXYS CORP ZILOG INC
Package Description PGA, PGA(UNSPEC) SDIP,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code PGA SDIP
Package Equivalence Code PGA(UNSPEC)
Package Style GRID ARRAY IN-LINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Speed 8 MHz 33 MHz
Supply Current-Max 50 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form PIN/PEG THROUGH-HOLE
Terminal Position PERPENDICULAR DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROCONTROLLER
Base Number Matches 2 1
Part Package Code DIP
Pin Count 64
Has ADC NO
Address Bus Width 18
Clock Frequency-Max 33 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width 8
JESD-30 Code R-PDIP-T64
Length 57.785 mm
Number of Terminals 64
PWM Channels NO
Package Shape RECTANGULAR
Seated Height-Max 5.01 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Terminal Pitch 1.778 mm
Width 19.05 mm

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