Part Details for 0603B104K250N by Fenghua (HK) Electronics Ltd
Overview of 0603B104K250N by Fenghua (HK) Electronics Ltd
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Applications
Education and Research
Industrial Automation
Electronic Manufacturing
Part Details for 0603B104K250N
0603B104K250N CAD Models
0603B104K250N Part Data Attributes
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0603B104K250N
Fenghua (HK) Electronics Ltd
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0603B104K250N
Fenghua (HK) Electronics Ltd
Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | FENGHUA ADVANCED TECHNOLOGY | |
| Package Description | , 0603 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8532.24.00.20 | |
| Capacitance | 0.1 µF | |
| Capacitor Type | CERAMIC CAPACITOR | |
| Dielectric Material | CERAMIC | |
| Height | 0.8 mm | |
| JESD-609 Code | e3 | |
| Length | 1.6 mm | |
| Mounting Feature | SURFACE MOUNT | |
| Multilayer | Yes | |
| Negative Tolerance | 10% | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Shape | RECTANGULAR PACKAGE | |
| Package Style | SMT | |
| Packing Method | BULK | |
| Positive Tolerance | 10% | |
| Rated (DC) Voltage (URdc) | 25 V | |
| Size Code | 0603 | |
| Surface Mount | YES | |
| Temperature Characteristics Code | X7R | |
| Temperature Coefficient | 15% ppm/°C | |
| Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier | |
| Terminal Shape | WRAPAROUND | |
| Width | 0.8 mm |
Alternate Parts for 0603B104K250N
This table gives cross-reference parts and alternative options found for 0603B104K250N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 0603B104K250N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| B37931K0104K070 | CAPACITOR, CERAMIC, MULTILAYER, 25V, X7R, 0.1uF, SURFACE MOUNT, 0603, CHIP | TDK Epcos | 0603B104K250N vs B37931K0104K070 |
| MBJCT168BB7104KTPA01 | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP | TAIYO YUDEN | 0603B104K250N vs MBJCT168BB7104KTPA01 |
| MMJCT168BB7104KTPA18 | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP | TAIYO YUDEN | 0603B104K250N vs MMJCT168BB7104KTPA18 |
| MCH182CN104KL | CAPACITOR, CERAMIC, MULTILAYER, 25V, X7R, 0.1uF, SURFACE MOUNT, 0603, CHIP | ROHM Semiconductor | 0603B104K250N vs MCH182CN104KL |
| MAAST168SB7104KTNA01 | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP | TAIYO YUDEN | 0603B104K250N vs MAAST168SB7104KTNA01 |
| 0603B104K250ST | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | 0603B104K250N vs 0603B104K250ST |
| CM105X7R104K25AH | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | KYOCERA Corporation | 0603B104K250N vs CM105X7R104K25AH |
| CM105X7R104K25AN | CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.1 uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT | KYOCERA Crystal Device Corporation | 0603B104K250N vs CM105X7R104K25AN |
| 0603B104K250CR | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | Walsin Technology Corporation | 0603B104K250N vs 0603B104K250CR |
| CM105X7R104K25AH | CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.1 uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT | KYOCERA Crystal Device Corporation | 0603B104K250N vs CM105X7R104K25AH |