Part Details for 24AA64-I/W16K by Microchip Technology Inc
Overview of 24AA64-I/W16K by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 24AA64-I/W16K
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
24AA64-I/W16K-ND
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DigiKey | IC EEPROM 64KBIT I2C 400KHZ DIE Lead time: 4 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
24AA64-I/W16K
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Microchip Technology Inc | 64K, 8K X 8, 1.8V SER EE, IND WAFER, Projected EOL: 2034-03-11 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: WJAR |
0 Alternates Available |
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$0.3600 / $0.5000 | Buy Now |
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NAC | 64K, 8K X 8, 1.8V SER EE, WAFER, Package: 0 WAFER WJAR - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for 24AA64-I/W16K
24AA64-I/W16K CAD Models
24AA64-I/W16K Part Data Attributes:
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24AA64-I/W16K
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
24AA64-I/W16K
Microchip Technology Inc
64K, 8K X 8, 1.8V SER EE, WAFER
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | DIE, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 0.4 MHz | |
| Data Retention Time-Min | 200 | |
| Endurance | 1000000 Write/Erase Cycles | |
| I2C Control Byte | 1010DDDR | |
| JESD-30 Code | R-XUUC-N | |
| Memory Density | 65536 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8KX8 | |
| Output Characteristics | OPEN-DRAIN | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 2.5 V | |
| Screening Level | TS 16949 | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000001 A | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Write Cycle Time-Max (tWC) | 5 ms | |
| Write Protection | HARDWARE |