Datasheets
28C010TRT4DE-12 by:

EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32

Part Details for 28C010TRT4DE-12 by Maxwell Technologies

Overview of 28C010TRT4DE-12 by Maxwell Technologies

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

Part Details for 28C010TRT4DE-12

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28C010TRT4DE-12 Part Data Attributes

28C010TRT4DE-12 Maxwell Technologies
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28C010TRT4DE-12 Maxwell Technologies EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32
Part Life Cycle Code Transferred
Ihs Manufacturer MAXWELL TECHNOLOGIES INC
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 120 ns
JESD-30 Code R-XDIP-T32
Length 40.64 mm
Memory Density 1048576 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Total Dose 40k Rad(Si) V
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for 28C010TRT4DE-12

This table gives cross-reference parts and alternative options found for 28C010TRT4DE-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 28C010TRT4DE-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
28C010TRTDI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation 28C010TRT4DE-12 vs 28C010TRTDI-12
28C010TRT1DI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Maxwell Technologies 28C010TRT4DE-12 vs 28C010TRT1DI-12
28C010TRTDI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Maxwell Technologies 28C010TRT4DE-12 vs 28C010TRTDI-12
FT28C010-12D-AT EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Force Technologies Ltd 28C010TRT4DE-12 vs FT28C010-12D-AT
28C010TRPDB-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Maxwell Technologies 28C010TRT4DE-12 vs 28C010TRPDB-12
AS28C010CW-12/Q EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, CERDIP-32 Micross Components 28C010TRT4DE-12 vs AS28C010CW-12/Q
28C010TRPDB-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation 28C010TRT4DE-12 vs 28C010TRPDB-12
5962-9679606HYA EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 White Microelectronics 28C010TRT4DE-12 vs 5962-9679606HYA
WME128K8-120CIA EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 28C010TRT4DE-12 vs WME128K8-120CIA
5962-3826707MXX EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32 Microchip Technology Inc 28C010TRT4DE-12 vs 5962-3826707MXX
Part Number Description Manufacturer Compare
28C010TRT1DB-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 Maxwell Technologies 28C010TRT4DE-12 vs 28C010TRT1DB-20
5962-8961413MXX UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor 28C010TRT4DE-12 vs 5962-8961413MXX
HN27C101AP-20 OTP ROM, 128KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd 28C010TRT4DE-12 vs HN27C101AP-20
HN62331AP 128KX8 MASK PROM, 120ns, PDIP32, PLASTIC, DIP-32 Renesas Electronics Corporation 28C010TRT4DE-12 vs HN62331AP
CAT28F001PI-12T Flash, 128KX8, 120ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor 28C010TRT4DE-12 vs CAT28F001PI-12T
DPV27C101-250B UVPROM, 128KX8, 250ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company 28C010TRT4DE-12 vs DPV27C101-250B
SMJ27C010A-20JM 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Texas Instruments 28C010TRT4DE-12 vs SMJ27C010A-20JM
28C010TRT4DE-15 EEPROM, 128KX8, 150ns, Parallel, CMOS, DIP-32 Maxwell Technologies 28C010TRT4DE-12 vs 28C010TRT4DE-15
5962-9669004HYX Flash, 128KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 28C010TRT4DE-12 vs 5962-9669004HYX
AM29F010B-45PC Flash, 128KX8, 45ns, PDIP32, PLASTIC, DIP-32 AMD 28C010TRT4DE-12 vs AM29F010B-45PC

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