Part Details for 3DFN32G64VB8263MSP-00 by 3D PLUS
Overview of 3DFN32G64VB8263MSP-00 by 3D PLUS
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Applications
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
Part Details for 3DFN32G64VB8263MSP-00
3DFN32G64VB8263MSP-00 CAD Models
3DFN32G64VB8263MSP-00 Part Data Attributes
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3DFN32G64VB8263MSP-00
3D PLUS
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Datasheet
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3DFN32G64VB8263MSP-00
3D PLUS
Flash, 512MX64, PBGA120, BGA-120
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| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | 3D PLUS SA | |
| Package Description | BGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| JESD-30 Code | R-PBGA-B120 | |
| Length | 24 mm | |
| Memory Density | 34359738368 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 64 | |
| Number of Functions | 1 | |
| Number of Terminals | 120 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512MX64 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 2.7 V | |
| Seated Height-Max | 13.1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 13.9 mm |