Part Details for 53S281AN by AMD
Overview of 53S281AN by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Part Details for 53S281AN
53S281AN CAD Models
53S281AN Part Data Attributes
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53S281AN
AMD
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Datasheet
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53S281AN
AMD
OTP ROM, 256X8, 40ns, Bipolar, PDIP24, PLASTIC, DIP-24
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 40 ns | |
JESD-30 Code | R-PDIP-T24 | |
Length | 32.004 mm | |
Memory Density | 2048 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 256X8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.715 mm | |
Supply Current-Max | 0.14 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for 53S281AN
This table gives cross-reference parts and alternative options found for 53S281AN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 53S281AN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM1702A | UVPROM, 256X8, 1000ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281AN vs AM1702A |
AM9702A-1HDC | UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | AMD | 53S281AN vs AM9702A-1HDC |
AM9702ALHDL | UVPROM, 256X8, 1000ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281AN vs AM9702ALHDL |
N82S214I | IC 256 X 8 OTPROM, 60 ns, CDIP24, Programmable ROM | NXP Semiconductors | 53S281AN vs N82S214I |
AM9702AL-2HDC | UVPROM, 256X8, 650ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | AMD | 53S281AN vs AM9702AL-2HDC |
AM9702A-1HDL | UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281AN vs AM9702A-1HDL |
N82S214I | OTP ROM, 256X8, 60ns, Bipolar, CDIP24 | Signetics | 53S281AN vs N82S214I |
N82S114I | IC 256 X 8 OTPROM, 60 ns, CDIP24, Programmable ROM | NXP Semiconductors | 53S281AN vs N82S114I |
AM9702AL-1HDC | UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | AMD | 53S281AN vs AM9702AL-1HDC |
AM9702AHDC | UVPROM, 256X8, 1000ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | AMD | 53S281AN vs AM9702AHDC |