Part Details for 5662-8606319XA by e2v technologies
Overview of 5662-8606319XA by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Audio and Video Systems
Energy and Power Systems
Medical Imaging
Entertainment and Gaming
Robotics and Drones
Part Details for 5662-8606319XA
5662-8606319XA CAD Models
5662-8606319XA Part Data Attributes:
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5662-8606319XA
e2v technologies
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Datasheet
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5662-8606319XA
e2v technologies
UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
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Part Life Cycle Code | Active | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Part Package Code | DIP | |
Package Description | HERMETIC SEALED, CERAMIC, DIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 55 ns | |
JESD-30 Code | R-GDIP-T28 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 Class B | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |
Alternate Parts for 5662-8606319XA
This table gives cross-reference parts and alternative options found for 5662-8606319XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5662-8606319XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY27C256-55WC | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | 5662-8606319XA vs CY27C256-55WC |
CY7C256-55WC | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | 5662-8606319XA vs CY7C256-55WC |
CY7C271-55WI | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 | Cypress Semiconductor | 5662-8606319XA vs CY7C271-55WI |
5962-8981704UA | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | QP Semiconductor | 5662-8606319XA vs 5962-8981704UA |
CY7C271A-55WI | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 | Cypress Semiconductor | 5662-8606319XA vs CY7C271A-55WI |
CY27H256-55WI | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | 5662-8606319XA vs CY27H256-55WI |
WS57C256F-55DM | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Waferscale Integration Inc | 5662-8606319XA vs WS57C256F-55DM |
CY27C256-55WI | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | 5662-8606319XA vs CY27C256-55WI |
AS27C256A-55JM/MIL | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | 5662-8606319XA vs AS27C256A-55JM/MIL |
5962-8606309XA | 32KX8 UVPROM, 55ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | 5662-8606319XA vs 5962-8606309XA |