Datasheets
5662-8606319XA by: e2v technologies

UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Part Details for 5662-8606319XA by e2v technologies

Overview of 5662-8606319XA by e2v technologies

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Applications Consumer Electronics Audio and Video Systems Energy and Power Systems Medical Imaging Entertainment and Gaming Robotics and Drones

Part Details for 5662-8606319XA

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5662-8606319XA Part Data Attributes:

5662-8606319XA e2v technologies
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5662-8606319XA e2v technologies UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 55 ns
JESD-30 Code R-GDIP-T28
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 5662-8606319XA

This table gives cross-reference parts and alternative options found for 5662-8606319XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5662-8606319XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY27C256-55WC UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY27C256-55WC
CY7C256-55WC UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY7C256-55WC
CY7C271-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY7C271-55WI
5962-8981704UA UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 QP Semiconductor 5662-8606319XA vs 5962-8981704UA
CY7C271A-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY7C271A-55WI
CY27H256-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY27H256-55WI
WS57C256F-55DM UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Waferscale Integration Inc 5662-8606319XA vs WS57C256F-55DM
CY27C256-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY27C256-55WI
AS27C256A-55JM/MIL UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5662-8606319XA vs AS27C256A-55JM/MIL
5962-8606309XA 32KX8 UVPROM, 55ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics 5662-8606319XA vs 5962-8606309XA
Part Number Description Manufacturer Compare
5962-8981701XX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 e2v technologies 5662-8606319XA vs 5962-8981701XX
QP7C271-55WMB UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, WINDOWED, DIP-28 e2v technologies 5662-8606319XA vs QP7C271-55WMB
AS27C256A-55JM/MIL UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5662-8606319XA vs AS27C256A-55JM/MIL
CY7C271A-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY7C271A-55WI
5962-8981701XX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor 5662-8606319XA vs 5962-8981701XX
5962-8606309XA 32KX8 UVPROM, 55ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics 5662-8606319XA vs 5962-8606309XA
CY27H256-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY27H256-55WI
CY7C279-55WMB UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 5662-8606319XA vs CY7C279-55WMB
5662-8606319YA UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 e2v technologies 5662-8606319XA vs 5662-8606319YA
5962-8981704UX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 e2v technologies 5662-8606319XA vs 5962-8981704UX

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