Part Details for CY27C256-55WI by Cypress Semiconductor
Overview of CY27C256-55WI by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for CY27C256-55WI
CY27C256-55WI CAD Models
CY27C256-55WI Part Data Attributes
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CY27C256-55WI
Cypress Semiconductor
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Datasheet
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CY27C256-55WI
Cypress Semiconductor
UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for CY27C256-55WI
This table gives cross-reference parts and alternative options found for CY27C256-55WI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY27C256-55WI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS57C256F-55T | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | Waferscale Integration Inc | CY27C256-55WI vs WS57C256F-55T |
| 5962-8981704UX | UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | CY27C256-55WI vs 5962-8981704UX |
| 5662-8606319XA | UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | CY27C256-55WI vs 5662-8606319XA |
| 5962-8981704UA | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | QP Semiconductor | CY27C256-55WI vs 5962-8981704UA |
| CY7C256-55WC | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | CY27C256-55WI vs CY7C256-55WC |
| CY7C279-55WMB | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | CY27C256-55WI vs CY7C279-55WMB |
| CY27H256-55WC | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | CY27C256-55WI vs CY27H256-55WC |
| WS57C256F-55T | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | e2v technologies | CY27C256-55WI vs WS57C256F-55T |
| CY27C256-55WC | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | CY27C256-55WI vs CY27C256-55WC |
| WS57C256F-55DM | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | e2v technologies | CY27C256-55WI vs WS57C256F-55DM |