Memory
5962-8606301XA
Description: UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28

Overview of 5962-8606301XA by Intel Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Price & Stock for 5962-8606301XA by Intel Corporation

Part # Manufacturer Description Stock Price Buy
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 9
  • 1 $67.6000
  • 8 $65.0000
$65.0000 / $67.6000 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 2
  • 1 $110.6000
  • 3 $105.0700
$105.0700 / $110.6000 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 1
  • 1 $104.3646
$104.3646 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 1
  • 1 $104.0000
$104.0000 Buy Now

CAD Models for 5962-8606301XA by Intel Corporation
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Part Data Attributes for 5962-8606301XA by Intel Corporation

5962-8606301XA
Intel Corporation
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEL CORP
Part Package Code
DIP
Package Description
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
200 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
JESD-609 Code
e0
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Standby Current-Max
0.0003 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Want to compare parts?
  1. 5962-8606301XA
    Intel Corporation
    UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28
    VS

Alternate Parts for 5962-8606301XA

This table gives cross-reference parts and alternative options found for 5962-8606301XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606301XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v 5962-8606301XA vs 5962-8606301XX
FT27C256R-20DM UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DM
AT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XA vs AT27C256R-20DM/883
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XA vs 5962-8606301XX
FT27C256R-20DI UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DI
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606301XA vs 5962-8606301XX
AT27C256R-20DC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XA vs AT27C256R-20DC
5962-8606301XA 32KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 Texas Instruments 5962-8606301XA vs 5962-8606301XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc 5962-8606301XA vs 5962-8606301XX
Part Number Description Manufacturer Compare
27C256/BXA-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28 YAGEO Corporation 5962-8606301XA vs 27C256/BXA-20
M38510/22402BYA UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28 Intel Corporation 5962-8606301XA vs M38510/22402BYA
TMS27PC256-20NE 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments 5962-8606301XA vs TMS27PC256-20NE
M27256-20F6 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics 5962-8606301XA vs M27256-20F6
QP27C256-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606301XA vs QP27C256-200/XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc 5962-8606301XA vs 5962-8606301XX
5662-860631YA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606301XA vs 5662-860631YA
MBM27C256A-20WZ 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 FUJITSU Limited 5962-8606301XA vs MBM27C256A-20WZ

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