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5962-8606301XX by:

UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

Part Details for 5962-8606301XX by Atmel Corporation

Overview of 5962-8606301XX by Atmel Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for 5962-8606301XX

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5962-8606301XX Part Data Attributes

5962-8606301XX Atmel Corporation
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5962-8606301XX Atmel Corporation UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code DIP
Package Description WINDOWED, CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.1475 mm
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.588 mm
Standby Current-Max 0.0003 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for 5962-8606301XX

This table gives cross-reference parts and alternative options found for 5962-8606301XX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606301XX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606301XX vs 5962-8606301XX
FT27C256R-20DI UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XX vs FT27C256R-20DI
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606301XX vs 5962-8606301XA
5962-8606301XC UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Atmel Corporation 5962-8606301XX vs 5962-8606301XC
5962-8606301XX 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments 5962-8606301XX vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc 5962-8606301XX vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XX vs 5962-8606301XX
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XX vs 5962-8606301XA
FT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XX vs FT27C256R-20DM/883
FT27C256R-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XX vs FT27C256R-20DMB
Part Number Description Manufacturer Compare
TMS27C256-2JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments 5962-8606301XX vs TMS27C256-2JE
27C256MQG/B20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v 5962-8606301XX vs 27C256MQG/B20
TMS27C256-2JL 262 144-Bitprogrammable Read-Only Memory 28-CDIP 0 to 70 Texas Instruments 5962-8606301XX vs TMS27C256-2JL
QD27256-20 UVPROM, 32KX8, 200ns, NMOS, CDIP28, CERDIP-28 Intel Corporation 5962-8606301XX vs QD27256-20
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XX vs 5962-8606301XA
FT27C256R-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XX vs FT27C256R-20DMB
NMC87C257Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 5962-8606301XX vs NMC87C257Q200
SMJ27C256-20J 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, WINDOWED, CERAMIC, DIP-28 Texas Instruments 5962-8606301XX vs SMJ27C256-20J
NM27LC256Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 5962-8606301XX vs NM27LC256Q200
AM27C256-205PC OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 AMD 5962-8606301XX vs AM27C256-205PC

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