Memory
5962-8606301XA
Description: IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM

Overview of 5962-8606301XA by NXP Semiconductors

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

CAD Models for 5962-8606301XA by NXP Semiconductors
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Part Data Attributes for 5962-8606301XA by NXP Semiconductors

5962-8606301XA
NXP Semiconductors
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
WDIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
200 ns
JESD-30 Code
R-GDIP-T28
JESD-609 Code
e0
Length
37.1475 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.588 mm
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. 5962-8606301XA
    NXP Semiconductors
    IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM
    VS

Alternate Parts for 5962-8606301XA

This table gives cross-reference parts and alternative options found for 5962-8606301XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606301XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
5962-8606301XC UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Atmel Corporation 5962-8606301XA vs 5962-8606301XC
FT27C256R-20DC UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DC
FT27C256R-20DI UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DI
FT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DM/883
AT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XA vs AT27C256R-20DM/883
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XA vs 5962-8606301XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XA vs 5962-8606301XX
5962-8606301XX 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments 5962-8606301XA vs 5962-8606301XX
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606301XA vs 5962-8606301XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs 5962-8606301XX
Part Number Description Manufacturer Compare
FT27C256R-20LM UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20LM
FT27C256R-20LMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20LMB
UPD27C256AD-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 NEC Electronics Group 5962-8606301XA vs UPD27C256AD-20
QP27C256L-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606301XA vs QP27C256L-200/XA
QD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation 5962-8606301XA vs QD27C256-200V10
CY27C256A-200WI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 5962-8606301XA vs CY27C256A-200WI
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation 5962-8606301XA vs NM27C256N200
WS27C256L-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Waferscale Integration Inc 5962-8606301XA vs WS27C256L-20DMB
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27C256-205DCB
AM27C256-200/BXA UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27C256-200/BXA

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