Part Details for 5962-8606309XX by STMicroelectronics
Overview of 5962-8606309XX by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for 5962-8606309XX
5962-8606309XX CAD Models
5962-8606309XX Part Data Attributes:
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5962-8606309XX
STMicroelectronics
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Datasheet
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5962-8606309XX
STMicroelectronics
32KX8 UVPROM, 55ns, CDIP28, 0.600 INCH, CERAMIC, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 5.8928 mm | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-8606309XX
This table gives cross-reference parts and alternative options found for 5962-8606309XX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606309XX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS57C256F-55D | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | e2v technologies | 5962-8606309XX vs WS57C256F-55D |
| CY7C256-55WC | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | 5962-8606309XX vs CY7C256-55WC |
| 5962-8606309XA | 32KX8 UVPROM, 55ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | 5962-8606309XX vs 5962-8606309XA |
| 5962-8981701XX | UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cypress Semiconductor | 5962-8606309XX vs 5962-8981701XX |
| WS57C256F-55TMB | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | e2v technologies | 5962-8606309XX vs WS57C256F-55TMB |
| 5962-8981701XX | UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | 5962-8606309XX vs 5962-8981701XX |
| 5962-8981704UX | UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | 5962-8606309XX vs 5962-8981704UX |
| AS27C256A-55JM | Memory IC | Micross Components | 5962-8606309XX vs AS27C256A-55JM |
| 5962-8606309UX | 32KX8 UVPROM, 55ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | 5962-8606309XX vs 5962-8606309UX |
| 5962-8981704UX | UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | 5962-8606309XX vs 5962-8981704UX |