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70T3339S133BFGI by:

512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray

Part Details for 70T3339S133BFGI by Renesas Electronics Corporation

Overview of 70T3339S133BFGI by Renesas Electronics Corporation

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Applications Computing and Data Storage

Price & Stock for 70T3339S133BFGI

Part # Distributor Description Stock Price Buy
DISTI # 70T3339S133BFGI-ND
DigiKey IC SRAM 9MBIT PARALLEL 208CABGA Min Qty: 21 Lead time: 36 Weeks Container: Tray Limited Supply - Call
  • 21 $260.1476
$260.1476 Buy Now
DISTI # 70T3339S133BFGI
Avnet Americas 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Trays (Alt: 70T3339S133BFGI) RoHS: Compliant Min Qty: 21 Package Multiple: 7 Lead time: 36 Weeks, 0 Days Container: Tray 0
  • 21 $266.0315
  • 35 $260.5274
  • 56 $255.0233
  • 105 $249.5192
  • 210 $244.0151
  • 1,050 $238.5110
  • 2,100 $233.0069
$233.0069 / $266.0315 Buy Now
DISTI # 972-70T3339S133BFGI
Mouser Electronics SRAM 512K X 18 DP RoHS: Compliant 20
  • 1 $256.7500
  • 7 $255.3100
$255.3100 / $256.7500 Buy Now
Future Electronics SRAM - Dual Port, Synchronous Memory IC 9Mbit Parallel 133 MHz RoHS: Compliant pbFree: Yes Min Qty: 21 Package Multiple: 7 Container: Tray 0
Tray
  • 21 $238.2800
$238.2800 Buy Now
DISTI # 70T3339S133BFGI
Avnet Americas 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Trays (Alt: 70T3339S133BFGI) RoHS: Compliant Min Qty: 21 Package Multiple: 7 Lead time: 36 Weeks, 0 Days Container: Tray 0
  • 21 $266.0315
  • 35 $260.5274
  • 56 $255.0233
  • 105 $249.5192
  • 210 $244.0151
  • 1,050 $238.5110
  • 2,100 $233.0069
$233.0069 / $266.0315 Buy Now
DISTI # 70T3339S133BFGI
Avnet Americas 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Trays (Alt: 70T3339S133BFGI) RoHS: Compliant Min Qty: 21 Package Multiple: 7 Lead time: 36 Weeks, 0 Days Container: Tray 0
  • 21 $266.0315
  • 35 $260.5274
  • 56 $255.0233
  • 105 $249.5192
  • 210 $244.0151
  • 1,050 $238.5110
  • 2,100 $233.0069
$233.0069 / $266.0315 Buy Now
DISTI # 70T3339S133BFGI
Avnet Silica 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's (Alt: 70T3339S133BFGI) RoHS: Compliant Min Qty: 7 Package Multiple: 7 Lead time: 3 Weeks, 6 Days Silica - 0
Buy Now

Part Details for 70T3339S133BFGI

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70T3339S133BFGI Part Data Attributes

Parametric Data
70T3339S133BFGI Renesas Electronics Corporation
Buy Now Datasheet
Compare Parts:
70T3339S133BFGI Renesas Electronics Corporation 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code End Of Life
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code CABGA
Pin Count 208
Manufacturer Package Code BFG208
Reach Compliance Code compliant
ECCN Code NLR
HTS Code 8542320041
Factory Lead Time 36 Weeks
Samacsys Manufacturer Renesas Electronics
Access Time-Max 4.2 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code S-CBGA-B208
JESD-609 Code e1
Length 15 mm
Memory Density 9437184 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX18
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code LFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm

Alternate Parts for 70T3339S133BFGI

This table gives cross-reference parts and alternative options found for 70T3339S133BFGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3339S133BFGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IDT70T3339S133BF8 Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs IDT70T3339S133BF8
70T3339S133BFI8 CABGA-208, Reel Integrated Device Technology Inc 70T3339S133BFGI vs 70T3339S133BFI8
IDT70T3339S133BFI Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs IDT70T3339S133BFI
IDT70T3339S133BF Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs IDT70T3339S133BF
70T3339S133BFI CABGA-208, Tray Integrated Device Technology Inc 70T3339S133BFGI vs 70T3339S133BFI
70T3339S133BFI 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray Renesas Electronics Corporation 70T3339S133BFGI vs 70T3339S133BFI
70T3339S133BF CABGA-208, Tray Integrated Device Technology Inc 70T3339S133BFGI vs 70T3339S133BF
70T3339S133BF8 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3339S133BFGI vs 70T3339S133BF8
70T3339S133BFG Dual-Port SRAM, 512KX18, 4.2ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs 70T3339S133BFG
70T3339S133BFGI8 Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs 70T3339S133BFGI8
Part Number Description Manufacturer Compare
70T633S15BF CABGA-208, Tray Integrated Device Technology Inc 70T3339S133BFGI vs 70T633S15BF
IDT70V7339S133BFI Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs IDT70V7339S133BFI
70T3339S166BF 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray Renesas Electronics Corporation 70T3339S133BFGI vs 70T3339S166BF
AS9C25512M2018L-166FI Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA208, FBGA-208 Integrated Silicon Solution Inc 70T3339S133BFGI vs AS9C25512M2018L-166FI
70T631S8BF8 Dual-Port SRAM, 256KX18, 8ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs 70T631S8BF8
AS9C25256M2018L-200FI Dual-Port SRAM, 256KX18, 7.5ns, CMOS, PBGA208, FBGA-208 Integrated Silicon Solution Inc 70T3339S133BFGI vs AS9C25256M2018L-200FI
70T633S8BF8 Dual-Port SRAM, 512KX18, 8ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs 70T633S8BF8
AS9C25256M2018L-133FC Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA208, FBGA-208 Integrated Silicon Solution Inc 70T3339S133BFGI vs AS9C25256M2018L-133FC
IDT70T633S10BFG Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HIEGHT, 0.80 MM, PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs IDT70T633S10BFG
IDT70V7319S166BFG8 Dual-Port SRAM, 256KX18, 12ns, PBGA208, FBGA-208 Integrated Device Technology Inc 70T3339S133BFGI vs IDT70V7319S166BFG8

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