Part Details for IDT70T3339S133BF by Integrated Device Technology Inc
Overview of IDT70T3339S133BF by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Electronic Manufacturing
Communication and Networking
Robotics and Drones
Part Details for IDT70T3339S133BF
IDT70T3339S133BF CAD Models
IDT70T3339S133BF Part Data Attributes:
|
|
IDT70T3339S133BF
Integrated Device Technology Inc
Buy Now
Datasheet
|
Compare Parts:
IDT70T3339S133BF
Integrated Device Technology Inc
Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA208,17X17,32 | |
| Pin Count | 208 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 15 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B208 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 208 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA208,17X17,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 2.4 V | |
| Supply Current-Max | 0.37 mA | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 15 mm |
Alternate Parts for IDT70T3339S133BF
This table gives cross-reference parts and alternative options found for IDT70T3339S133BF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT70T3339S133BF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70T3339S133BFG8 | Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 | Integrated Device Technology Inc | IDT70T3339S133BF vs IDT70T3339S133BFG8 |
| 70T3339S133BF | CABGA-208, Tray | Integrated Device Technology Inc | IDT70T3339S133BF vs 70T3339S133BF |
| 70T3339S133BFI8 | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | IDT70T3339S133BF vs 70T3339S133BFI8 |
| IDT70T3339S133BFGI8 | Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 | Integrated Device Technology Inc | IDT70T3339S133BF vs IDT70T3339S133BFGI8 |
| 70T3339S133BFI | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray | Renesas Electronics Corporation | IDT70T3339S133BF vs 70T3339S133BFI |
| IDT70T3339S133BFI | Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 | Integrated Device Technology Inc | IDT70T3339S133BF vs IDT70T3339S133BFI |
| IDT70T3339S133BFGI | Dual-Port SRAM, 512KX18, 4.2ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 | Integrated Device Technology Inc | IDT70T3339S133BF vs IDT70T3339S133BFGI |
| 70T3339S133BFG8 | Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 | Integrated Device Technology Inc | IDT70T3339S133BF vs 70T3339S133BFG8 |
| 70T3339S133BFI | CABGA-208, Tray | Integrated Device Technology Inc | IDT70T3339S133BF vs 70T3339S133BFI |
| 70T3339S133BFGI | 512K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray | Renesas Electronics Corporation | IDT70T3339S133BF vs 70T3339S133BFGI |