-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for 71T75602S166BGGI8 by Renesas Electronics Corporation
Overview of 71T75602S166BGGI8 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for 71T75602S166BGGI8
71T75602S166BGGI8 CAD Models
71T75602S166BGGI8 Part Data Attributes
|
|
71T75602S166BGGI8
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
71T75602S166BGGI8
Renesas Electronics Corporation
2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA0/Reel
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | PBGA | |
| Pin Count | 119 | |
| Manufacturer Package Code | BGG119 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320041 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 3.5 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.36 mm | |
| Standby Current-Max | 0.06 A | |
| Standby Voltage-Min | 2.38 V | |
| Supply Current-Max | 0.265 mA | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm |
Alternate Parts for 71T75602S166BGGI8
This table gives cross-reference parts and alternative options found for 71T75602S166BGGI8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71T75602S166BGGI8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT71T75602S166BGG8 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | Integrated Device Technology Inc | 71T75602S166BGGI8 vs IDT71T75602S166BGG8 |
| 71T75602S200BGI | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028AA, BGA-119 | Integrated Device Technology Inc | 71T75602S166BGGI8 vs 71T75602S200BGI |
| 71T75602S166BGG | 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA84/Tray | Renesas Electronics Corporation | 71T75602S166BGGI8 vs 71T75602S166BGG |
| 71T75602S166BG8 | PBGA-119, Reel | Integrated Device Technology Inc | 71T75602S166BGGI8 vs 71T75602S166BG8 |
| K7N163645A-HI16 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, BGA-119 | Samsung Semiconductor | 71T75602S166BGGI8 vs K7N163645A-HI16 |
| IDT71T75602S200BGGI8 | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | Integrated Device Technology Inc | 71T75602S166BGGI8 vs IDT71T75602S200BGGI8 |
| IDT71T75602S166BGI | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | 71T75602S166BGGI8 vs IDT71T75602S166BGI |
| IDT71T75602S200BGG | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | 71T75602S166BGGI8 vs IDT71T75602S200BGG |
| 71T75602S166BGGI | 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA84/Tray | Renesas Electronics Corporation | 71T75602S166BGGI8 vs 71T75602S166BGGI |
| 71T75602S166BGI8 | PBGA-119, Reel | Integrated Device Technology Inc | 71T75602S166BGGI8 vs 71T75602S166BGI8 |