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256 x 9 DualAsync FIFO, 5.0V, TSSOP34/Tube
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
7280L12PAG | Renesas Electronics Corporation | 256 x 9 DualAsync FIFO, 5.0V | |
7280L12PAG8 | Renesas Electronics Corporation | 256 x 9 DualAsync FIFO, 5.0V |
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
7280L12PAG
|
Avnet Americas | 256 x 9 DualAsync FIFO, 5.0V - Rail/Tube (Alt: 7280L12PAG) RoHS: Compliant Min Qty: 20 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tube | 34 Partner Stock |
|
$16.2900 / $19.1600 | Buy Now |
|
Rochester Electronics | 7280 - 256 x 9 DualAsync FIFO, 5.0V ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 34 |
|
$16.2900 / $19.1600 | Buy Now |
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7280L12PAG
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
7280L12PAG
Renesas Electronics Corporation
256 x 9 DualAsync FIFO, 5.0V, TSSOP34/Tube
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | TSSOP | |
Package Description | TSSOP-56 | |
Pin Count | 56 | |
Manufacturer Package Code | PAG56 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542320071 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 12 ns | |
Additional Feature | RETRANSMIT | |
Clock Frequency-Max (fCLK) | 50 MHz | |
Cycle Time | 20 ns | |
JESD-30 Code | R-PDSO-G56 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Memory Density | 2304 bit | |
Memory IC Type | OTHER FIFO | |
Memory Width | 9 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 56 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256X9 | |
Output Enable | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP56,.3,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.015 A | |
Supply Current-Max | 0.125 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6.1 mm |