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Memory / FIFOs / 72T18125L10BB
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72T18125L10BB by:

512K x 18 / 1M x 9 TeraSync FIFO, 2.5V, PBGA84/Tray

Part Details for 72T18125L10BB by Renesas Electronics Corporation

Overview of 72T18125L10BB by Renesas Electronics Corporation

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for 72T18125L10BB

Part # Distributor Description Stock Price Buy
DISTI # 800-2329-ND
DigiKey IC FIFO ASYNC/SYNC 1MX9 240BGA Min Qty: 25 Lead time: 18 Weeks Container: Tray Limited Supply - Call
  • 25 $211.8076
$211.8076 Buy Now
DISTI # 72T18125L10BB
Avnet Americas 512K x 18 / 1M x 9 TeraSync FIFO, 2.5V - Trays (Alt: 72T18125L10BB) RoHS: Not Compliant Min Qty: 25 Package Multiple: 1 Container: Tray 0
  • 25 $221.4730
  • 30 $216.8908
  • 60 $212.3086
  • 130 $207.7264
  • 250 $203.1442
  • 1,300 $198.5620
  • 2,500 $193.9798
$193.9798 / $221.4730 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 25 Package Multiple: 1 Lead time: 36 Weeks Container: Tray 0
Tray
  • 25 $195.8300
$195.8300 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 25 Package Multiple: 1 Lead time: 36 Weeks Container: Tray 0
Tray
  • 25 $198.3700
$198.3700 Buy Now

Part Details for 72T18125L10BB

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72T18125L10BB Part Data Attributes

Parametric Data
72T18125L10BB Renesas Electronics Corporation
Buy Now Datasheet
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72T18125L10BB Renesas Electronics Corporation 512K x 18 / 1M x 9 TeraSync FIFO, 2.5V, PBGA84/Tray
Pbfree Code No
Rohs Code No
Part Life Cycle Code End Of Life
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code PBGA
Package Description BGA-240
Pin Count 240
Manufacturer Package Code BB240
Reach Compliance Code not_compliant
ECCN Code NLR
HTS Code 8542320071
Factory Lead Time 26 Weeks, 1 Day
Samacsys Manufacturer Renesas Electronics
Access Time-Max 4.5 ns
Additional Feature ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
Alternate Memory Width 9
Clock Frequency-Max (fCLK) 50 MHz
Cycle Time 10 ns
JESD-30 Code S-PBGA-B240
JESD-609 Code e0
Length 19 mm
Memory Density 9437184 bit
Memory IC Type OTHER FIFO
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 240
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX18
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA240,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.97 mm
Standby Current-Max 0.02 A
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 19 mm

Alternate Parts for 72T18125L10BB

This table gives cross-reference parts and alternative options found for 72T18125L10BB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 72T18125L10BB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
72T18125L10BB PBGA-240, Tray Integrated Device Technology Inc 72T18125L10BB vs 72T18125L10BB
Part Number Description Manufacturer Compare
72T18125L4-4BB 512K x 18 / 1M x 9 TeraSync FIFO, 2.5V, PBGA84/Tray Renesas Electronics Corporation 72T18125L10BB vs 72T18125L4-4BB
IDT72T18125L39176BB FIFO, 512KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc 72T18125L10BB vs IDT72T18125L39176BB
72T18125L5BB 512K x 18 / 1M x 9 TeraSync FIFO, 2.5V, PBGA84/Tray Renesas Electronics Corporation 72T18125L10BB vs 72T18125L5BB
IDT72T18125L6-7BB FIFO, 512KX18, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc 72T18125L10BB vs IDT72T18125L6-7BB
72T18125L10BB PBGA-240, Tray Integrated Device Technology Inc 72T18125L10BB vs 72T18125L10BB
72T18125L4-4BBGI FIFO, 512KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc 72T18125L10BB vs 72T18125L4-4BBGI
72T18125L4-4BBG PBGA-240, Tray Integrated Device Technology Inc 72T18125L10BB vs 72T18125L4-4BBG
IDT72T18125L6-7BBG FIFO, 512KX18, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc 72T18125L10BB vs IDT72T18125L6-7BBG
IDT72T18125L39240BB FIFO, 512KX18, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc 72T18125L10BB vs IDT72T18125L39240BB
IDT72T18125L4-4BBG FIFO, 512KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc 72T18125L10BB vs IDT72T18125L4-4BBG

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