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512K x 18 / 1M x 9 TeraSync FIFO, 2.5V, PBGA84/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
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72T18125L10BB | Renesas Electronics Corporation | 512K x 18 / 1M x 9 TeraSync FIFO, 2.5V |
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72T18125L10BB
Renesas Electronics Corporation
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Datasheet
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72T18125L10BB
Renesas Electronics Corporation
512K x 18 / 1M x 9 TeraSync FIFO, 2.5V, PBGA84/Tray
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | PBGA | |
Package Description | BGA-240 | |
Pin Count | 240 | |
Manufacturer Package Code | BB240 | |
Reach Compliance Code | not_compliant | |
ECCN Code | NLR | |
HTS Code | 8542320071 | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 4.5 ns | |
Additional Feature | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | |
Alternate Memory Width | 9 | |
Clock Frequency-Max (fCLK) | 50 MHz | |
Cycle Time | 10 ns | |
JESD-30 Code | S-PBGA-B240 | |
JESD-609 Code | e0 | |
Length | 19 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | OTHER FIFO | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 240 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX18 | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA240,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.97 mm | |
Standby Current-Max | 0.02 A | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 19 mm |
This table gives cross-reference parts and alternative options found for 72T18125L10BB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 72T18125L10BB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
72T18125L10BBG | FIFO, 512KX18, 4.5ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | Integrated Device Technology Inc | 72T18125L10BB vs 72T18125L10BBG |
IDT72T18125L10BBG | FIFO, 512KX18, 4.5ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | Integrated Device Technology Inc | 72T18125L10BB vs IDT72T18125L10BBG |
IDT72T18125L10BB | FIFO, 512KX18, 4.5ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | Integrated Device Technology Inc | 72T18125L10BB vs IDT72T18125L10BB |