Datasheets
8201002EX by:

Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16

Part Details for 8201002EX by AMD

Overview of 8201002EX by AMD

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Part Details for 8201002EX

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8201002EX Part Data Attributes

8201002EX AMD
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8201002EX AMD Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP,
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FAST PAGE
Access Time-Max 150 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code R-GDIP-T16
Memory Density 65536 bit
Memory IC Type PAGE MODE DRAM
Memory Width 1
Number of Functions 1
Number of Ports 1
Number of Terminals 16
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 110 °C
Operating Temperature-Min -55 °C
Organization 64KX1
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade OTHER
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 8201002EX

This table gives cross-reference parts and alternative options found for 8201002EX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8201002EX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
8201002EX 64KX1 PAGE MODE DRAM, 150ns, CDIP16, CERAMIC, DIP-16 STMicroelectronics 8201002EX vs 8201002EX
8201001EX Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16 Teledyne e2v 8201002EX vs 8201001EX
8201006EA Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16 Rochester Electronics LLC 8201002EX vs 8201006EA
8201001EX Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16 Atmel Corporation 8201002EX vs 8201001EX
8201002EX Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16 Thales Components Corp 8201002EX vs 8201002EX
8201006EA 64KX1 PAGE MODE DRAM, 150ns, CDIP16, CERAMIC, DIP-16 STMicroelectronics 8201002EX vs 8201006EA
8201006EX Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16 AMD 8201002EX vs 8201006EX
8201002EX Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERAMIC, DIP-16 Teledyne e2v 8201002EX vs 8201002EX
Part Number Description Manufacturer Compare
MB8281-15P Static Column DRAM, 64KX1, 150ns, NMOS, PDIP16, PLASTIC, DIP-16 FUJITSU Semiconductor Limited 8201002EX vs MB8281-15P
D2164A-15 Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 Intel Corporation 8201002EX vs D2164A-15
P51C64L-10 Nibble Mode DRAM, 64KX1, 100ns, CMOS, PDIP16, PLASTIC, DIP-16 Intel Corporation 8201002EX vs P51C64L-10
SMJ4164-15JDE 64KX1 PAGE MODE DRAM, 150ns, CDIP16, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-16 Texas Instruments 8201002EX vs SMJ4164-15JDE
MB8264A-15-W Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERDIP-16 FUJITSU Semiconductor Limited 8201002EX vs MB8264A-15-W
8201008EA Page Mode DRAM, 64KX1, 120ns, NMOS, CDIP16, CERAMIC, DIP-16 Rochester Electronics LLC 8201002EX vs 8201008EA
P51C64L-12 Nibble Mode DRAM, 64KX1, 120ns, CMOS, PDIP16, PLASTIC, DIP-16 Intel Corporation 8201002EX vs P51C64L-12
8201003EX Page Mode DRAM, 64KX1, 200ns, NMOS, CDIP16, CERAMIC, DIP-16 Thales Components Corp 8201002EX vs 8201003EX
MSM3764A-15RS Page Mode DRAM, 64KX1, 150ns, NMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 OKI Electric Industry Co Ltd 8201002EX vs MSM3764A-15RS
M38510/24403BEA 64KX1 PAGE MODE DRAM, 200ns, DIP16, 0.25 X 0.875 INCH, DIP-16 STMicroelectronics 8201002EX vs M38510/24403BEA

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