Part Details for 93C66BE/P by Microchip Technology Inc
Overview of 93C66BE/P by Microchip Technology Inc
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Part Details for 93C66BE/P
93C66BE/P CAD Models
93C66BE/P Part Data Attributes
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93C66BE/P
Microchip Technology Inc
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Datasheet
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93C66BE/P
Microchip Technology Inc
256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | 0.300 INCH, PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| Additional Feature | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | |
| Clock Frequency-Max (fCLK) | 2 MHz | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e3 | |
| Length | 9.46 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256X16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.32 mm | |
| Serial Bus Type | MICROWIRE | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.62 mm | |
| Write Cycle Time-Max (tWC) | 2 ms |
Alternate Parts for 93C66BE/P
This table gives cross-reference parts and alternative options found for 93C66BE/P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 93C66BE/P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M93C66-BN7G | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | STMicroelectronics | 93C66BE/P vs M93C66-BN7G |
| FM93C66ATEN | EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 | Fairchild Semiconductor Corporation | 93C66BE/P vs FM93C66ATEN |
| CAT93C66AP | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | onsemi | 93C66BE/P vs CAT93C66AP |
| M93C66-BN3G/W | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | STMicroelectronics | 93C66BE/P vs M93C66-BN3G/W |
| NM93C66EN | IC 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Programmable ROM | National Semiconductor Corporation | 93C66BE/P vs NM93C66EN |
| NM93C66MN | EEPROM, 256X16, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Fairchild Semiconductor Corporation | 93C66BE/P vs NM93C66MN |
| M93C66-BN7P | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | STMicroelectronics | 93C66BE/P vs M93C66-BN7P |
| NMC93C66N | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 | Texas Instruments | 93C66BE/P vs NMC93C66N |
| M93C66-BN3P | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, PLASTIC, LEAD FREE, DIP-8 | STMicroelectronics | 93C66BE/P vs M93C66-BN3P |
| NMC93C66N | IC 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, PLASTIC, DIP-8, Programmable ROM | National Semiconductor Corporation | 93C66BE/P vs NMC93C66N |