Part Details for 93C46B/S15K by Microchip Technology Inc
Overview of 93C46B/S15K by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for 93C46B/S15K
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
93C46B/S15K-ND
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DigiKey | IC EEPROM 1KBIT MICROWIRE DIE Lead time: 4 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
DISTI #
93C46B/S15K
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Microchip Technology Inc | 1K, 64 X 16 SERIAL EE, Projected EOL: 2034-04-25 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: WPAC |
0 Alternates Available |
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$0.2100 / $0.2600 | Buy Now |
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NAC | 1K, 64 X 16 SERIAL EE DIE in WAFFLE PK, Package: 0 DICE WPAC - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for 93C46B/S15K
93C46B/S15K CAD Models
93C46B/S15K Part Data Attributes:
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93C46B/S15K
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
93C46B/S15K
Microchip Technology Inc
1K, 64 X 16 SERIAL EE, 0C to +70C, Die-Waffle, WPAC
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Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | DICE | |
Reach Compliance Code | compliant | |
Clock Frequency-Max (fCLK) | 3 MHz | |
Data Retention Time-Min | 200 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | X-XUUC-N | |
Memory Density | 1024 bit | |
Memory IC Type | EEPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words | 64 words | |
Number of Words Code | 64 | |
Operating Mode | SYNCHRONOUS | |
Organization | 64X16 | |
Output Characteristics | TOTEM POLE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | UNSPECIFIED | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Ready/Busy | YES | |
Reverse Pinout | NO | |
Screening Level | TS 16949 | |
Serial Bus Type | MICROWIRE | |
Supply Current-Max | 0.002 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Write Cycle Time-Max (tWC) | 2 ms | |
Write Protection | SOFTWARE |