Part Details for 93C66C/WF15K by Microchip Technology Inc
Overview of 93C66C/WF15K by Microchip Technology Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for 93C66C/WF15K
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
93C66C/WF15K-ND
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DigiKey | IC EEPROM 4KBIT MICROWIRE DIE Lead time: 4 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
DISTI #
93C66C/WF15K
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Microchip Technology Inc | 4K, 512 X 8 OR 256 X 16, SER EE, Projected EOL: 2048-10-03 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: WFRAME |
0 Alternates Available |
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$0.2200 / $0.2900 | Buy Now |
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NAC | 4K, 512 X 8 OR 256 X 16 SERIAL EE WAFER on FR, Package: 0 WAFER WFRAME - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for 93C66C/WF15K
93C66C/WF15K CAD Models
93C66C/WF15K Part Data Attributes
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93C66C/WF15K
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
93C66C/WF15K
Microchip Technology Inc
4K, 512 X 8 OR 256 X 16, SER EE, 0C to +70C, Wafer-Frame, WFRAME
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Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | WAFER | |
Reach Compliance Code | compliant | |
Additional Feature | ALSO OPERATES WITH 1.8V @1MHZ | |
Alternate Memory Width | 8 | |
Clock Frequency-Max (fCLK) | 3 MHz | |
Data Retention Time-Min | 200 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | X-XUUC-N | |
Memory Density | 4096 bit | |
Memory IC Type | EEPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256X16 | |
Output Characteristics | TOTEM POLE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | UNSPECIFIED | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Ready/Busy | YES | |
Reverse Pinout | NO | |
Screening Level | TS 16949 | |
Serial Bus Type | MICROWIRE | |
Supply Current-Max | 0.002 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Toggle Bit | YES | |
Write Cycle Time-Max (tWC) | 2 ms | |
Write Protection | SOFTWARE |
Alternate Parts for 93C66C/WF15K
This table gives cross-reference parts and alternative options found for 93C66C/WF15K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 93C66C/WF15K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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93C66C-I/W15K | 4K, 512 X 8 OR 256 X 16, SER EE, -40C to +85C, Uncut Wafer, WJAR | Microchip Technology Inc | 93C66C/WF15K vs 93C66C-I/W15K |
93C66C-I/WF15K | 4K, 512 X 8 OR 256 X 16, SER EE, -40C to +85C, Wafer-Frame, WFRAME | Microchip Technology Inc | 93C66C/WF15K vs 93C66C-I/WF15K |