Part Details for 93C66C-I/S15K by Microchip Technology Inc
Overview of 93C66C-I/S15K by Microchip Technology Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for 93C66C-I/S15K
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
93C66C-I/S15K-ND
|
DigiKey | IC EEPROM 4KBIT MICROWIRE DIE Lead time: 4 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
DISTI #
93C66C-I/S15K
|
Microchip Technology Inc | 4K, 512 X 8 OR 256 X 16, SER EE, Projected EOL: 2048-10-03 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: WPAC |
0 Alternates Available |
|
$0.2400 / $0.3300 | Buy Now |
|
NAC | 4K, 512 X 8 OR 256 X 16 SERIAL EE DIE in WAFFLE PK, Package: 0 DICE WPAC - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
|
RFQ |
Part Details for 93C66C-I/S15K
93C66C-I/S15K CAD Models
93C66C-I/S15K Part Data Attributes
|
93C66C-I/S15K
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
93C66C-I/S15K
Microchip Technology Inc
4K, 512 X 8 OR 256 X 16, SER EE, -40C to +85C, Die-Waffle, WPAC
|
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | DICE | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Additional Feature | ALSO OPERATES WITH 1.8VMIN @1MHZ AND 2.5VMIN @2MHZ | |
Alternate Memory Width | 8 | |
Clock Frequency-Max (fCLK) | 3 MHz | |
Data Retention Time-Min | 200 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-XUUC-N | |
Memory Density | 4096 bit | |
Memory IC Type | EEPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256X16 | |
Output Characteristics | TOTEM POLE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Ready/Busy | YES | |
Reverse Pinout | NO | |
Screening Level | TS 16949 | |
Serial Bus Type | MICROWIRE | |
Standby Current-Max | 0.000001 A | |
Supply Current-Max | 0.002 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Toggle Bit | YES | |
Write Cycle Time-Max (tWC) | 2 ms | |
Write Protection | SOFTWARE |
Alternate Parts for 93C66C-I/S15K
This table gives cross-reference parts and alternative options found for 93C66C-I/S15K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 93C66C-I/S15K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
93C66CXT-E/MNY | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66CXT-E/MNY |
93C66CXT-E/SNG | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66CXT-E/SNG |
93C66C-I/MNY | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66C-I/MNY |
93C66CX-E/ST | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66CX-E/ST |
93C66CX-I/MSG | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66CX-I/MSG |
93C66C-I/ST | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66C-I/ST |
93C66C-I/MCG | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66C-I/MCG |
93C66CX-I/MCG | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66CX-I/MCG |
93C66CX-I/MNY | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66CX-I/MNY |
93C66CT-E/SN | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | Microchip Technology Inc | 93C66C-I/S15K vs 93C66CT-E/SN |