There are no models available for this part yet.
Overview of AM2764A-30LE by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| EVAL-AD7730LEBZ | Analog Devices | EVALUATION BOARD I.C. | |
| 2SJ530L-E | Renesas Electronics Corporation | Pch Single Power Mosfet -60V -15A 100Mohm DPAK(L)-(2)/To-251 | |
| 2SJ130L-E | Renesas Electronics Corporation | Silicon P Channel MOSFET |
CAD Models for AM2764A-30LE by AMD
Part Data Attributes for AM2764A-30LE by AMD
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
|
Part Package Code
|
QFJ
|
|
Package Description
|
QCCN, LCC32,.45X.55
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Access Time-Max
|
300 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-CQCC-N32
|
|
JESD-609 Code
|
e0
|
|
Length
|
13.97 mm
|
|
Memory Density
|
65536 bit
|
|
Memory IC Type
|
OTP ROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
8192 words
|
|
Number of Words Code
|
8000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
8KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
QCCN
|
|
Package Equivalence Code
|
LCC32,.45X.55
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
CHIP CARRIER
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
12.5 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
3.556 mm
|
|
Supply Current-Max
|
0.07 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
NMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
QUAD
|
|
Width
|
11.43 mm
|
Alternate Parts for AM2764A-30LE
This table gives cross-reference parts and alternative options found for AM2764A-30LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2764A-30LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM2764-30 | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | AM2764A-30LE vs MBM2764-30 |
| AM27C64-305LI | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM2764A-30LE vs AM27C64-305LI |
| MBM2764-30 | UVPROM, 8KX8, 300ns, NMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | AM2764A-30LE vs MBM2764-30 |
| AM27C64-300LC | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM2764A-30LE vs AM27C64-300LC |
| MBM2764-30-X | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | AM2764A-30LE vs MBM2764-30-X |
| AM27C64-300LCB | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM2764A-30LE vs AM27C64-300LCB |
| AM27C64-305LCB | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM2764A-30LE vs AM27C64-305LCB |
| MBM27C6430ZW | UVPROM, 8KX8, 300ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | AM2764A-30LE vs MBM27C6430ZW |
| MBM27C64-30 | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | AM2764A-30LE vs MBM27C64-30 |
| AM27C64-300/BUA | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM2764A-30LE vs AM27C64-300/BUA |