Memory
AM27C64-300LIB
AMD
Description: UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32

Overview of AM27C64-300LIB by AMD

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Industrial Automation

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Part Data Attributes for AM27C64-300LIB by AMD

AM27C64-300LIB
AMD
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
Part Package Code
QFJ
Package Description
WQCCN, LCC32,.45X.55
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
300 ns
I/O Type
COMMON
JESD-30 Code
R-CQCC-N32
Length
13.97 mm
Memory Density
65536 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
WQCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER, WINDOW
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Seated Height-Max
3.556 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
Want to compare parts?
  1. AM27C64-300LIB
    AMD
    UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
    VS

Alternate Parts for AM27C64-300LIB

This table gives cross-reference parts and alternative options found for AM27C64-300LIB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-300LIB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MBM2764-30 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM27C64-300LIB vs MBM2764-30
AM27C64-305LI UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C64-300LIB vs AM27C64-305LI
MBM2764-30 UVPROM, 8KX8, 300ns, NMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited AM27C64-300LIB vs MBM2764-30
AM2764A-30LE UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD AM27C64-300LIB vs AM2764A-30LE
AM27C64-300LC UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C64-300LIB vs AM27C64-300LC
MBM2764-30-X 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM27C64-300LIB vs MBM2764-30-X
AM27C64-300LCB UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C64-300LIB vs AM27C64-300LCB
AM27C64-305LCB UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C64-300LIB vs AM27C64-305LCB
MBM27C6430ZW UVPROM, 8KX8, 300ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited AM27C64-300LIB vs MBM27C6430ZW
MBM27C64-30 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM27C64-300LIB vs MBM27C64-30
Part Number Description Manufacturer Compare
AM27C64-305LIB UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C64-300LIB vs AM27C64-305LIB
MBM27C6430ZW UVPROM, 8KX8, 300ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited AM27C64-300LIB vs MBM27C6430ZW
NMC27C64Q300 IC 8K X 8 UVPROM, 300 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27C64-300LIB vs NMC27C64Q300
AM2764A-30DI UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27C64-300LIB vs AM2764A-30DI
MBM27C64-30-X UVPROM, 8KX8, 300ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited AM27C64-300LIB vs MBM27C64-30-X
MBM27C64-30-XZ UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERDIP-28 FUJITSU Semiconductor Limited AM27C64-300LIB vs MBM27C64-30-XZ
QD2764A-3 UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Intel Corporation AM27C64-300LIB vs QD2764A-3
MBM2764-30 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM27C64-300LIB vs MBM2764-30
AM2764A-30LE UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD AM27C64-300LIB vs AM2764A-30LE
M27C64A-30F1 8KX8 UVPROM, 300ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics AM27C64-300LIB vs M27C64A-30F1

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