Part Details for AM27S21ADCTB by AMD
Overview of AM27S21ADCTB by AMD
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Applications
Consumer Electronics
Computing and Data Storage
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Part Details for AM27S21ADCTB
AM27S21ADCTB CAD Models
AM27S21ADCTB Part Data Attributes
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AM27S21ADCTB
AMD
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Datasheet
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AM27S21ADCTB
AMD
OTP ROM, 256X4, 30ns, TTL, CDIP16
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | DIP, DIP16,.3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 30 ns | |
JESD-30 Code | R-XDIP-T16 | |
JESD-609 Code | e0 | |
Memory Density | 1024 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256X4 | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Supply Current-Max | 0.13 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | TTL | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |