Memory
AS27C256A-55JM/MIL
Micross Components
Description: UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28

Overview of AS27C256A-55JM/MIL by Micross Components

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
MD28F020-12/R Rochester Electronics LLC 28F020 - 256K X 8 Flash, Mil Temp
COM1553A/B Rochester Electronics LLC COM1553A/B - Mil-Std-1553B Smart Controller
MD28F020-90/R Rochester Electronics LLC 28F020 - 256K X 8 Flash, Mil Temp

CAD Models for AS27C256A-55JM/MIL by Micross Components
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Part Data Attributes for AS27C256A-55JM/MIL by Micross Components

AS27C256A-55JM/MIL
Micross Components
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
AUSTIN SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
55 ns
JESD-30 Code
R-CDIP-T28
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.8928 mm
Supply Current-Max
0.001 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Want to compare parts?
  1. AS27C256A-55JM/MIL
    Micross Components
    UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
    VS

Alternate Parts for AS27C256A-55JM/MIL

This table gives cross-reference parts and alternative options found for AS27C256A-55JM/MIL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS27C256A-55JM/MIL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY7C279-55WC UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor AS27C256A-55JM/MIL vs CY7C279-55WC
5962-8606309XX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components AS27C256A-55JM/MIL vs 5962-8606309XX
5962-8606319XX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components AS27C256A-55JM/MIL vs 5962-8606319XX
5962-8981704UX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor AS27C256A-55JM/MIL vs 5962-8981704UX
QP7C271-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, WINDOWED, DIP-28 Teledyne e2v AS27C256A-55JM/MIL vs QP7C271-55WI
5962-8606319XX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v AS27C256A-55JM/MIL vs 5962-8606319XX
5962-8606319XA UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor AS27C256A-55JM/MIL vs 5962-8606319XA
IS27HC256-55CWI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Integrated Silicon Solution Inc AS27C256A-55JM/MIL vs IS27HC256-55CWI
CY27C256-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor AS27C256A-55JM/MIL vs CY27C256-55WI
5962-8606309XX UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor AS27C256A-55JM/MIL vs 5962-8606309XX
Part Number Description Manufacturer Compare
QP27C256-55/XA UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v AS27C256A-55JM/MIL vs QP27C256-55/XA
CY7C271A-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor AS27C256A-55JM/MIL vs CY7C271A-55WI
CY27C256T-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor AS27C256A-55JM/MIL vs CY27C256T-55WI
5662-8606319QYA UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v AS27C256A-55JM/MIL vs 5662-8606319QYA
5962-8981704UA UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor AS27C256A-55JM/MIL vs 5962-8981704UA
5662-8606319XA UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v AS27C256A-55JM/MIL vs 5662-8606319XA
CY27C256-55WC UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Rochester Electronics LLC AS27C256A-55JM/MIL vs CY27C256-55WC
CY7C271-55WI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor AS27C256A-55JM/MIL vs CY7C271-55WI
QP27C256-55/YA UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v AS27C256A-55JM/MIL vs QP27C256-55/YA
IS27HC256-55CWI UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Integrated Silicon Solution Inc AS27C256A-55JM/MIL vs IS27HC256-55CWI

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