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Overview of AS8S512K32Q1-55/Q by Micross Components
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for AS8S512K32Q1-55/Q by Micross Components
Part Data Attributes for AS8S512K32Q1-55/Q by Micross Components
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
MICROSS COMPONENTS
|
|
Part Package Code
|
QFP
|
|
Package Description
|
QFP, QFP68,.99SQ,50
|
|
Pin Count
|
68
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
55 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
S-CQFP-G68
|
|
JESD-609 Code
|
e0
|
|
Length
|
22.352 mm
|
|
Memory Density
|
16777216 bit
|
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Memory IC Type
|
SRAM MODULE
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|
Memory Width
|
32
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
68
|
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Number of Words
|
524288 words
|
|
Number of Words Code
|
512000
|
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Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
512KX32
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
QFP
|
|
Package Equivalence Code
|
QFP68,.99SQ,50
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
FLATPACK
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Screening Level
|
38535Q/M;38534H;883B
|
|
Seated Height-Max
|
5.08 mm
|
|
Standby Current-Max
|
0.08 A
|
|
Standby Voltage-Min
|
4.5 V
|
|
Supply Current-Max
|
0.55 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
1.27 mm
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Terminal Position
|
QUAD
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|
Width
|
22.352 mm
|
Alternate Parts for AS8S512K32Q1-55/Q
This table gives cross-reference parts and alternative options found for AS8S512K32Q1-55/Q. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS8S512K32Q1-55/Q, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS8S512K32Q1-55/IT | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 | Micross Components | AS8S512K32Q1-55/Q vs AS8S512K32Q1-55/IT |
| 5962-9461111HAC | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 | White Electronic Designs Corp | AS8S512K32Q1-55/Q vs 5962-9461111HAC |
| AS8S512K32Q1-55/XT | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 | Micross Components | AS8S512K32Q1-55/Q vs AS8S512K32Q1-55/XT |
| WS512K32-55G2LIA | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Mercury Systems Inc | AS8S512K32Q1-55/Q vs WS512K32-55G2LIA |
| 5962-9461105HAA | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, QFP-68 | Micross Components | AS8S512K32Q1-55/Q vs 5962-9461105HAA |
| 5962-9461105HAC | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68 | White Electronic Designs Corp | AS8S512K32Q1-55/Q vs 5962-9461105HAC |
| WS512K32-55G2LQ | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Mercury Systems Inc | AS8S512K32Q1-55/Q vs WS512K32-55G2LQ |
| AS8S512K32Q1-55/883C | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, BQFP-68 | Micross Components | AS8S512K32Q1-55/Q vs AS8S512K32Q1-55/883C |
| WS512K32-55G2LC | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Mercury Systems Inc | AS8S512K32Q1-55/Q vs WS512K32-55G2LC |
| AS8S512K32Q1-55L/883 | SRAM Module, | Micross Components | AS8S512K32Q1-55/Q vs AS8S512K32Q1-55L/883 |