WS512K32-55G2LIA
Description: SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

Overview of WS512K32-55G2LIA by Mercury Systems Inc

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Part Data Attributes for WS512K32-55G2LIA by Mercury Systems Inc

WS512K32-55G2LIA
Mercury Systems Inc
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MERCURY SYSTEMS INC
Package Description
QFP,
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
55 ns
Additional Feature
USER CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
JESD-30 Code
S-CQFP-G68
Length
22.36 mm
Memory Density
16777216 bit
Memory IC Type
SRAM MODULE
Memory Width
32
Number of Functions
1
Number of Terminals
68
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
Package Shape
SQUARE
Package Style
FLATPACK
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
5.1 mm
Supply Current-Max
0.66 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
22.36 mm
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  1. WS512K32-55G2LIA
    Mercury Systems Inc
    SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
    VS

Alternate Parts for WS512K32-55G2LIA

This table gives cross-reference parts and alternative options found for WS512K32-55G2LIA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K32-55G2LIA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AS8S512K32Q1-55/IT SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components WS512K32-55G2LIA vs AS8S512K32Q1-55/IT
5962-9461111HAC SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 White Electronic Designs Corp WS512K32-55G2LIA vs 5962-9461111HAC
AS8S512K32Q1-55/XT SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components WS512K32-55G2LIA vs AS8S512K32Q1-55/XT
5962-9461105HAA SRAM Module, 512KX32, 55ns, CMOS, CQFP68, QFP-68 Micross Components WS512K32-55G2LIA vs 5962-9461105HAA
5962-9461105HAC SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68 White Electronic Designs Corp WS512K32-55G2LIA vs 5962-9461105HAC
WS512K32-55G2LQ SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc WS512K32-55G2LIA vs WS512K32-55G2LQ
AS8S512K32Q1-55/883C SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, BQFP-68 Micross Components WS512K32-55G2LIA vs AS8S512K32Q1-55/883C
WS512K32-55G2LC SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc WS512K32-55G2LIA vs WS512K32-55G2LC
AS8S512K32Q1-55L/883 SRAM Module, Micross Components WS512K32-55G2LIA vs AS8S512K32Q1-55L/883
WS512K32-55G2LCA SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc WS512K32-55G2LIA vs WS512K32-55G2LCA
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp WS512K32-55G2LIA vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor WS512K32-55G2LIA vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors WS512K32-55G2LIA vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd WS512K32-55G2LIA vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd WS512K32-55G2LIA vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp WS512K32-55G2LIA vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp WS512K32-55G2LIA vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited WS512K32-55G2LIA vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp WS512K32-55G2LIA vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics WS512K32-55G2LIA vs IMS1820W-35

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