Datasheets
BAP51LX,315 by: NXP Semiconductors

BAP51LX - Silicon PIN diode DFN 2-Pin

Part Details for BAP51LX,315 by NXP Semiconductors

Overview of BAP51LX,315 by NXP Semiconductors

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Applications Consumer Electronics Industrial Automation Energy and Power Systems Renewable Energy Motor control systems

Price & Stock for BAP51LX,315

Part # Distributor Description Stock Price Buy
DISTI # 568-14481-1-ND
DigiKey RF DIODE PIN 60V 140MW SOD2 Min Qty: 1 Lead time: 52 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) Temporarily Out of Stock
  • 1 $0.4000
$0.4000 Buy Now

Part Details for BAP51LX,315

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BAP51LX,315 Part Data Attributes

BAP51LX,315 NXP Semiconductors
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BAP51LX,315 NXP Semiconductors BAP51LX - Silicon PIN diode DFN 2-Pin
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DFN
Package Description 1 X 0.60 MM, 0.40 MM HEIGHT, PLASTIC, SOD-882T, 2 PIN
Pin Count 2
Manufacturer Package Code SOD882D
Reach Compliance Code compliant
HTS Code 8541.10.00.70
Samacsys Manufacturer NXP
Application ATTENUATOR; SWITCHING
Breakdown Voltage-Min 60 V
Configuration SINGLE
Diode Capacitance-Max 0.4 pF
Diode Capacitance-Nom 0.3 pF
Diode Element Material SILICON
Diode Forward Resistance-Max 1.5 Ω
Diode Res Test Current 500 mA
Diode Res Test Frequency 100 MHz
Diode Type PIN DIODE
Frequency Band S BAND
JESD-30 Code R-PDSO-N2
JESD-609 Code e3
Minority Carrier Lifetime-Nom 0.55 µs
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max 0.14 W
Qualification Status Not Qualified
Reverse Test Voltage
Surface Mount YES
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish Tin (Sn)
Terminal Form NO LEAD
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30

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