Part Details for BU9888FV-WE2 by ROHM Semiconductor
Overview of BU9888FV-WE2 by ROHM Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for BU9888FV-WE2
Part # | Distributor | Description | Stock | Price | Buy | |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 10 Weeks Container: Reel | 0Reel |
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$0.4480 | Buy Now |
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CoreStaff Co Ltd | PBF(Ship within 1day) - D/C 2011 Date Code: 2011 | 50 |
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$0.2850 / $0.4100 | Buy Now |
Part Details for BU9888FV-WE2
BU9888FV-WE2 CAD Models
BU9888FV-WE2 Part Data Attributes
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BU9888FV-WE2
ROHM Semiconductor
Buy Now
Datasheet
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Compare Parts:
BU9888FV-WE2
ROHM Semiconductor
EEPROM, 256X16, Serial, CMOS, PDSO8, 3 X 6.40 MM, 1.35 MM HEIGHT, ROHS COMPLAINT, SSOP-8
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ROHM CO LTD | |
Part Package Code | SOIC | |
Package Description | LSSOP, TSSOP8,.25 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 2 MHz | |
Data Retention Time-Min | 40 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G8 | |
Length | 3 mm | |
Memory Density | 4096 bit | |
Memory IC Type | EEPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Organization | 256X16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LSSOP | |
Package Equivalence Code | TSSOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.35 mm | |
Serial Bus Type | 3-WIRE | |
Standby Current-Max | 0.000002 A | |
Supply Current-Max | 0.0035 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 4.4 mm | |
Write Cycle Time-Max (tWC) | 2 ms | |
Write Protection | SOFTWARE |
Alternate Parts for BU9888FV-WE2
This table gives cross-reference parts and alternative options found for BU9888FV-WE2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BU9888FV-WE2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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93AA56BT-I/MNY | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | BU9888FV-WE2 vs 93AA56BT-I/MNY |
93C46CX-E/SN | 64 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | Microchip Technology Inc | BU9888FV-WE2 vs 93C46CX-E/SN |
24LC128-E/MF | 16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 | Microchip Technology Inc | BU9888FV-WE2 vs 24LC128-E/MF |
S-25A160B0A-K8T2U3 | IC EEPROM 16K SPI 6.5MHZ 8TMSOP | ABLIC Inc. | BU9888FV-WE2 vs S-25A160B0A-K8T2U3 |
93C56AT-I/MNY | 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | BU9888FV-WE2 vs 93C56AT-I/MNY |
11AA161T-I/MNY | 2K X 8 1-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | Microchip Technology Inc | BU9888FV-WE2 vs 11AA161T-I/MNY |
24FC64FT-I/OT | 24FC64FT-I/OT | Microchip Technology Inc | BU9888FV-WE2 vs 24FC64FT-I/OT |
BR25H040FJ-WC | EEPROM, 512X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, SOP-8 | ROHM Semiconductor | BU9888FV-WE2 vs BR25H040FJ-WC |
BR95010-WMN6TP | EEPROM, 1KX1, Serial, CMOS, PDSO8, MS-012AA, SO-8 | ROHM Semiconductor | BU9888FV-WE2 vs BR95010-WMN6TP |
BR93L66-W | EEPROM, 256X16, Serial, CMOS, PDIP8, ROHS COMPLIANT, DIP-8 | ROHM Semiconductor | BU9888FV-WE2 vs BR93L66-W |