Datasheets
C3216X5R1E476M160AC by: TDK Corporation

Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, X5R, 15% TC, 47uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT

Part Details for C3216X5R1E476M160AC by TDK Corporation

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Part Details for C3216X5R1E476M160AC

C3216X5R1E476M160AC CAD Models

C3216X5R1E476M160AC Part Data Attributes

C3216X5R1E476M160AC TDK Corporation
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C3216X5R1E476M160AC TDK Corporation Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, X5R, 15% TC, 47uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TDK CORP
Package Description , 1206
Reach Compliance Code compliant
ECCN Code EAR99
Factory Lead Time 52 Weeks
Capacitance 47 µF
Capacitor Type CERAMIC CAPACITOR
Dielectric Material CERAMIC
Height 1.6 mm
JESD-609 Code e3
Length 3.2 mm
Mounting Feature SURFACE MOUNT
Multilayer Yes
Negative Tolerance 20%
Number of Terminals 2
Operating Temperature-Max 85 °C
Operating Temperature-Min -55 °C
Package Shape RECTANGULAR PACKAGE
Package Style SMT
Packing Method TR, 7 INCH
Positive Tolerance 20%
Rated (DC) Voltage (URdc) 25 V
Size Code 1206
Surface Mount YES
Temperature Characteristics Code X5R
Temperature Coefficient 15% ppm/°C
Terminal Finish MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND
Width 1.6 mm

Resources and Additional Insights for C3216X5R1E476M160AC

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    The TIDA-00794 reference design is a temp sensing solution for IGBT thermal protection in HEV/EV traction inverter system. It monitors the IGBT temperature via the NTC thermistor integrated inside the IGBT module. It provides thermal shut down to the IGBT gate drivers once the NTC thermistor temperature rises above the programmed threshold. The design includes the IGBT isolated gate drivers: isolation to the high voltage: NTC signal conditioning: Load resistor: and I2C interface to the MSP430: which enables the design system to run independently under high power ratings.
  • Reference Design Maximizing Signal Dynamic Range for True 10 Vpp Differential Input to 20 bit ADC
    This reference design is designed for high performance data acquisition(DAQ) systems to improve the dynamic range of 20 bit differential input ADCs. Many DAQ systems require the measurement capability at a wide FSR (Full Scale Range) in order to obtain sufficient signal dynamic range. Many earlier reference designs for SAR ADCs have used the THS4551 FDA (fully differential amplifier). However: the THS4551 is limited to a 5.4V maximum supply which is not sufficient for realizing the true 10Vpp differential output (10V FSR) required to maximize the dynamic range of SAR ADCs with a 5V reference. This reference design explores the benefits of a true 10Vpp differential output by implementing TI's new THS4561 FDA which has a maximum supply of 12.6V. You will see that this design was able to achieve superior performance to the previous design (TIDA-01054) while also lowering overall power consumption.
  • 13-V to 36-V in: 12-V 125-mA output power module reference design with 0.1% output voltage ripple
    This e-meter applications reference design implements a synchronous buck converter TPS560430 with high efficiency. The efficiency is up to 91.8% at 18-V input and 125-mA output. The output voltage ripple is less than 0.1% of output voltage. The design is available in a compact form factor with 16 mm × 16 mm and one layer placement.
  • PMP8762 用于消费类电子产品的低线路、宽输入范围 LLC 谐振式转换器 (12V/10A)
    PMP8762 参考设计使用单 LLC 谐振转换器级通过低线路输入电压(100Vac 至 132Vac)提供 12V/10A 输出。该设计的特点是电路成本低、电磁干扰(感应和辐射)小且效率高(满负荷时超过 87%)。该设计使用 UCC25600 谐振转换器控制器及 UCC27702 高侧闸极驱动器来控制 LLC 谐振转换器。
  • 1 Phase AC Input: 5W 4 Rail Outputs Reference Design for E-meter
    The reference design was designed for the 1 phase smart meter application. It uses the UCC28600 quasi-resonant flyback controller to generate four 3KV isolated output rails from an extremely wide input source from 85VAC to 300VAC. The four output rails have independent protections to improve system reliability. The synchronous buck converter TPS560430 was used on the 12V 0.3A rail to generate a 0.1% output ripple voltage for post modules. The board size is 100mm(L)*43.5mm(W)*20mm(H).
  • CC1020EB_REFDES CC1020 评估板参考设计
    The CC1020EB reference design contains schematics and layout files for the CC1020 Evaluation Board. The Evaluation Board serves as a motherboard for the CC1020, CC1021, CC1070, and CC1000uCSP Evaluation Modules. The CC1020EB, connected to a PC running the SmartRF® Studio software, can be used
  • Reference Design Optimizing FPGA Utilization and Data Throughput for Automatic Test Equipment
    The TIDA-01051 reference design is used to demonstrate optimized channel density: integration: power consumption: clock distribution and signal chain performance of very high channel count data acquisition (DAQ) systems such as those used in automatic test equipment (ATE). Using serializers: such as TI’s DS90C383B: to combine many simultaneously sampling ADC outputs into several LVDS lines dramatically reduces the number of pins the host FPGA must process.  As a result: a single FPGA can process a significantly increased number of DAQ channels and board routing complexity is greatly reduced.
  • PMP5239 适用于通信的同步降压 (5V@200mA)
    PMP5239 使用 TPS40021 搭配 NexFET 在 18A 时提供 1.8V,关断时为 3.3V。TPS61027 还在 200mA 时提供 5V 电压。
  • TIDEP0028 Ethernet Powerlink 开发平台
    The TIDEP0028 Ethernet Powerlink development platform combines the AM335x Sitara processor family from Texas Instruments (TI) and the Powerlink open media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Ethernet Powerlink slave communications, the TIDEP0028 al
  • PMP7185 升压,5.0V/0.9A
    具有 5.0V (0.9A) 输出的非同步升压转换器。
  • PMP7024 无光耦合器的隔离型反激式 (6.2V (1A))
    此款反激式无需使用光耦合器,可在输入电压范围为 18 至 28V 的情况下生成 12V (0.6A) 和 6.2V (1A)。

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