Part Details for CE28C010H-250 by LSI Corporation
Overview of CE28C010H-250 by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Transportation and Logistics
Automotive
Part Details for CE28C010H-250
CE28C010H-250 CAD Models
CE28C010H-250 Part Data Attributes
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CE28C010H-250
LSI Corporation
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Datasheet
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CE28C010H-250
LSI Corporation
EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
| Package Description | DIP, DIP32,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| Additional Feature | AUTOMATIC WRITE;PAGE WRITE;BULK ERASE | |
| Command User Interface | NO | |
| Data Polling | YES | |
| Endurance | 10000 Write/Erase Cycles | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Page Size | 128 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.00085 A | |
| Supply Current-Max | 0.12 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | YES | |
| Write Cycle Time-Max (tWC) | 5 ms |
Alternate Parts for CE28C010H-250
This table gives cross-reference parts and alternative options found for CE28C010H-250. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CE28C010H-250, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-9679602HYC | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Mercury Systems Inc | CE28C010H-250 vs 5962-9679602HYC |
| 5962-9679602HYA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Microsemi Corporation | CE28C010H-250 vs 5962-9679602HYA |
| WME128K8-250CMA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CE28C010H-250 vs WME128K8-250CMA |
| WME128K8-250CI | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | CE28C010H-250 vs WME128K8-250CI |
| CM28C010H-250 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32 | LSI Corporation | CE28C010H-250 vs CM28C010H-250 |
| CQ28C010-250 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32 | LSI Corporation | CE28C010H-250 vs CQ28C010-250 |
| WME128K8-250CM | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CE28C010H-250 vs WME128K8-250CM |
| WME128K8-250CQ | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CE28C010H-250 vs WME128K8-250CQ |
| WME128K8-250CC | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CE28C010H-250 vs WME128K8-250CC |
| WPE128K8C-250WM | EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32, | White Microelectronics | CE28C010H-250 vs WPE128K8C-250WM |