Part Details for CL10B103KB8NNNP by Samsung Electro-Mechanics
Overview of CL10B103KB8NNNP by Samsung Electro-Mechanics
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Applications
Automotive
Part Details for CL10B103KB8NNNP
CL10B103KB8NNNP CAD Models
CL10B103KB8NNNP Part Data Attributes
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CL10B103KB8NNNP
Samsung Electro-Mechanics
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Datasheet
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CL10B103KB8NNNP
Samsung Electro-Mechanics
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0603, CHIP
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SAMSUNG ELECTRO-MECHANICS | |
| Package Description | , 0603 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8532.24.00.20 | |
| Capacitance | 0.01 µF | |
| Capacitor Type | CERAMIC CAPACITOR | |
| Dielectric Material | CERAMIC | |
| Height | 0.8 mm | |
| JESD-609 Code | e3 | |
| Length | 1.6 mm | |
| Mounting Feature | SURFACE MOUNT | |
| Multilayer | Yes | |
| Negative Tolerance | 10% | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Shape | RECTANGULAR PACKAGE | |
| Package Style | SMT | |
| Packing Method | BULK | |
| Positive Tolerance | 10% | |
| Rated (DC) Voltage (URdc) | 50 V | |
| Size Code | 0603 | |
| Surface Mount | YES | |
| Temperature Characteristics Code | X7R | |
| Temperature Coefficient | 15% ppm/°C | |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier | |
| Terminal Shape | WRAPAROUND | |
| Width | 0.8 mm |
Alternate Parts for CL10B103KB8NNNP
This table gives cross-reference parts and alternative options found for CL10B103KB8NNNP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CL10B103KB8NNNP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DM105X7R103K50KC | Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.01uF, 0603, | KYOCERA Corporation | CL10B103KB8NNNP vs DM105X7R103K50KC |
| B37931K5103K070 | CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 0.01uF, SURFACE MOUNT, 0603, CHIP, LEAD FREE | TDK Epcos | CL10B103KB8NNNP vs B37931K5103K070 |
| DM105X7R103K50AT | CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 0.01uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT | KYOCERA Corporation | CL10B103KB8NNNP vs DM105X7R103K50AT |
| ST18B103K500CT | Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0603, CHIP | Walsin Technology Corporation | CL10B103KB8NNNP vs ST18B103K500CT |
| DM105X7R103K50AL | CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 0.01uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT | KYOCERA Corporation | CL10B103KB8NNNP vs DM105X7R103K50AL |
| 0603B103K500NT | Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | CL10B103KB8NNNP vs 0603B103K500NT |
| DM105X7R103K50KH | CAP,CERAMIC,10NF,50VDC,10% -TOL,10% +TOL,X7R TC CODE,-15,15% TC,0603 CASE | KYOCERA Crystal Device Corporation | CL10B103KB8NNNP vs DM105X7R103K50KH |
| CM105X7R103K50AN | CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT | KYOCERA Crystal Device Corporation | CL10B103KB8NNNP vs CM105X7R103K50AN |
| CGJ3E2X7R1H103KT | Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | TDK Corporation | CL10B103KB8NNNP vs CGJ3E2X7R1H103KT |
| DM105X7R103K50AB | CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT | KYOCERA Crystal Device Corporation | CL10B103KB8NNNP vs DM105X7R103K50AB |