There are no models available for this part yet.
Overview of CM28C010H-150 by LSI Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for CM28C010H-150 by LSI Corporation
Part Data Attributes for CM28C010H-150 by LSI Corporation
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SEEQ TECHNOLOGY INC
|
|
Package Description
|
DIP, DIP32,.6
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
150 ns
|
|
Additional Feature
|
AUTOMATIC WRITE;PAGE WRITE;BULK ERASE
|
|
Command User Interface
|
NO
|
|
Data Polling
|
YES
|
|
Data Retention Time-Min
|
10
|
|
Endurance
|
10000 Write/Erase Cycles
|
|
JESD-30 Code
|
R-CDIP-T32
|
|
JESD-609 Code
|
e0
|
|
Length
|
40.64 mm
|
|
Memory Density
|
1048576 bit
|
|
Memory IC Type
|
EEPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
128KX8
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP32,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Page Size
|
128 words
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
5 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.08 mm
|
|
Standby Current-Max
|
0.00085 A
|
|
Supply Current-Max
|
0.12 mA
|
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Toggle Bit
|
YES
|
|
Width
|
15.24 mm
|
|
Write Cycle Time-Max (tWC)
|
5 ms
|
Alternate Parts for CM28C010H-150
This table gives cross-reference parts and alternative options found for CM28C010H-150. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CM28C010H-150, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WME128K8-150CIEA | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CM28C010H-150 vs WME128K8-150CIEA |
| WME128K8-150CIA | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | CM28C010H-150 vs WME128K8-150CIA |
| WE128K8150CMA | EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CM28C010H-150 vs WE128K8150CMA |
| WME128K8-150CIA | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CM28C010H-150 vs WME128K8-150CIA |
| WME128K8-150CCEA | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CM28C010H-150 vs WME128K8-150CCEA |
| CQ28C010-150 | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDIP32 | LSI Corporation | CM28C010H-150 vs CQ28C010-150 |
| WE128K8150CIA | EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CM28C010H-150 vs WE128K8150CIA |
| WME128K8-150CI | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | CM28C010H-150 vs WME128K8-150CI |
| WE128K8150CQA | EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CM28C010H-150 vs WE128K8150CQA |
| WE128K8150CI | EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | CM28C010H-150 vs WE128K8150CI |