Part Details for CY7C1312KV18-250BZC by Infineon Technologies AG
Overview of CY7C1312KV18-250BZC by Infineon Technologies AG
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1312KV18-250BZC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2832-CY7C1312KV18-250BZC-ND
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DigiKey | IC SRAM 18MBIT PAR 165FBGA Min Qty: 11 Lead time: 11 Weeks Container: Tray MARKETPLACE PRODUCT |
1679 In Stock |
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$23.1400 | Buy Now |
DISTI #
2156-CY7C1312KV18-250BZC-ND
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DigiKey | IC SRAM 18MBIT PAR 165FBGA Min Qty: 11 Lead time: 11 Weeks Container: Bulk MARKETPLACE PRODUCT |
336 In Stock |
|
$28.7400 | Buy Now |
DISTI #
CY7C1312KV18-250BZC-ND
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DigiKey | IC SRAM 18MBIT PAR 165FBGA Min Qty: 11 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$26.7335 | Buy Now |
DISTI #
CY7C1312KV18-250BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1312KV18-250BZ) RoHS: Not Compliant Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$27.8460 / $33.8130 | Buy Now |
DISTI #
CY7C1312KV18-250BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1312KV18-250BZ) RoHS: Not Compliant Min Qty: 29 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 1679 Partner Stock |
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RFQ | |
DISTI #
CY7C1312KV18-250BZ
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1312KV18-250BZ) RoHS: Not Compliant Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$27.8460 / $33.8130 | Buy Now |
DISTI #
CY7C1312KV18-250BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1312KV18-250BZ) RoHS: Not Compliant Min Qty: 29 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 1679 Partner Stock |
|
RFQ |
Part Details for CY7C1312KV18-250BZC
CY7C1312KV18-250BZC CAD Models
CY7C1312KV18-250BZC Part Data Attributes:
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CY7C1312KV18-250BZC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1312KV18-250BZC
Infineon Technologies AG
QDR II SRAM, 1MX18, 0.45ns, CMOS, PBGA165,
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Rohs Code | No | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Factory Lead Time | 11 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 250 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | QDR II SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.25 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.56 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 13 mm |
Alternate Parts for CY7C1312KV18-250BZC
This table gives cross-reference parts and alternative options found for CY7C1312KV18-250BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1312KV18-250BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1312KV18-250BZI | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1312KV18-250BZC vs CY7C1312KV18-250BZI |
CY7C1312KV18-250BZCT | Standard SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1312KV18-250BZC vs CY7C1312KV18-250BZCT |
CY7C1312KV18-250BZXCT | Standard SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1312KV18-250BZC vs CY7C1312KV18-250BZXCT |
CY7C1312KV18-250BZXC | QDR II SRAM, 1MX18, 0.45ns, CMOS, PBGA165, | Infineon Technologies AG | CY7C1312KV18-250BZC vs CY7C1312KV18-250BZXC |
CY7C1312KV18-250BZXC | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1312KV18-250BZC vs CY7C1312KV18-250BZXC |
CY7C1312KV18-250BZXI | QDR II SRAM, 1MX18, 0.45ns, CMOS, PBGA165, | Infineon Technologies AG | CY7C1312KV18-250BZC vs CY7C1312KV18-250BZXI |
CY7C1312KV18-250BZXI | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1312KV18-250BZC vs CY7C1312KV18-250BZXI |