Part Details for CY7C1370CV25-200BGC by Cypress Semiconductor
Overview of CY7C1370CV25-200BGC by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for CY7C1370CV25-200BGC
CY7C1370CV25-200BGC CAD Models
CY7C1370CV25-200BGC Part Data Attributes
|
CY7C1370CV25-200BGC
Cypress Semiconductor
Buy Now
Datasheet
|
Compare Parts:
CY7C1370CV25-200BGC
Cypress Semiconductor
ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | |
Pin Count | 119 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 3 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 200 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B119 | |
JESD-609 Code | e0 | |
Length | 22 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA119,7X17,50 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.4 mm | |
Standby Current-Max | 0.06 A | |
Standby Voltage-Min | 2.38 V | |
Supply Current-Max | 0.3 mA | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |
Alternate Parts for CY7C1370CV25-200BGC
This table gives cross-reference parts and alternative options found for CY7C1370CV25-200BGC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1370CV25-200BGC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
IDT71T75602S166BGG8 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | Integrated Device Technology Inc | CY7C1370CV25-200BGC vs IDT71T75602S166BGG8 |
71T75602S200BGI | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028AA, BGA-119 | Integrated Device Technology Inc | CY7C1370CV25-200BGC vs 71T75602S200BGI |
71T75602S166BGG | 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA84/Tray | Renesas Electronics Corporation | CY7C1370CV25-200BGC vs 71T75602S166BGG |
71T75602S166BG8 | PBGA-119, Reel | Integrated Device Technology Inc | CY7C1370CV25-200BGC vs 71T75602S166BG8 |
K7N163645A-HI16 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, BGA-119 | Samsung Semiconductor | CY7C1370CV25-200BGC vs K7N163645A-HI16 |
IDT71T75602S200BGGI8 | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | Integrated Device Technology Inc | CY7C1370CV25-200BGC vs IDT71T75602S200BGGI8 |
IDT71T75602S166BGI | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | CY7C1370CV25-200BGC vs IDT71T75602S166BGI |
IDT71T75602S200BGG | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | CY7C1370CV25-200BGC vs IDT71T75602S200BGG |
71T75602S166BGGI | 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA84/Tray | Renesas Electronics Corporation | CY7C1370CV25-200BGC vs 71T75602S166BGGI |
71T75602S166BGI8 | PBGA-119, Reel | Integrated Device Technology Inc | CY7C1370CV25-200BGC vs 71T75602S166BGI8 |