Datasheets
CY7C263-55DMB by:

OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24

Part Details for CY7C263-55DMB by Cypress Semiconductor

Overview of CY7C263-55DMB by Cypress Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for CY7C263-55DMB

Part # Distributor Description Stock Price Buy
Quest Components   91
  • 1 $99.7262
  • 25 $79.7810
  • 64 $77.2878
$77.2878 / $99.7262 Buy Now
Quest Components   1
  • 1 $119.6714
$119.6714 Buy Now

Part Details for CY7C263-55DMB

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CY7C263-55DMB Part Data Attributes:

CY7C263-55DMB Cypress Semiconductor
Buy Now Datasheet
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CY7C263-55DMB Cypress Semiconductor OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description 0.300 INCH, SLIM, CERDIP-24
Pin Count 24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 55 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.877 mm
Memory Density 65536 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Standby Current-Max 0.03 A
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for CY7C263-55DMB

This table gives cross-reference parts and alternative options found for CY7C263-55DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C263-55DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
N82HS641NB IC 8K X 8 OTPROM, 55 ns, PDIP24, Programmable ROM NXP Semiconductors CY7C263-55DMB vs N82HS641NB
N82HS641F OTP ROM, 8KX8, 55ns, Bipolar, CDIP24 YAGEO Corporation CY7C263-55DMB vs N82HS641F
N82HS641F IC 8K X 8 OTPROM, 55 ns, CDIP24, Programmable ROM NXP Semiconductors CY7C263-55DMB vs N82HS641F
N82HS641NB 8KX8 OTPROM, 55ns, PDIP24 Philips Semiconductors CY7C263-55DMB vs N82HS641NB
82HS641A/BJA IC 8K X 8 OTPROM, 55 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM NXP Semiconductors CY7C263-55DMB vs 82HS641A/BJA
CY7C261-55PI OTP ROM, 8KX8, 55ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 Cypress Semiconductor CY7C263-55DMB vs CY7C261-55PI
AM27S49A/BLA OTP ROM, 8KX8, 55ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 AMD CY7C263-55DMB vs AM27S49A/BLA
93Z565DCQR OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation CY7C263-55DMB vs 93Z565DCQR
N82HS641N OTP ROM, 8KX8, 55ns, Bipolar, PDIP24 Signetics CY7C263-55DMB vs N82HS641N
93Z564DC OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation CY7C263-55DMB vs 93Z564DC
Part Number Description Manufacturer Compare
R29793DM/883B OTP ROM, 8KX8, 95ns, Bipolar, CDIP24, 0.600 INCH, CERDIP-24 Fairchild Semiconductor Corporation CY7C263-55DMB vs R29793DM/883B
CY7C263-20PC OTP ROM, 8KX8, 20ns, CMOS, PDIP24, 0.300 INCH, DIP-24 Cypress Semiconductor CY7C263-55DMB vs CY7C263-20PC
27HC641L-70I/SP 8K X 8 OTPROM, 70 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 Microchip Technology Inc CY7C263-55DMB vs 27HC641L-70I/SP
MB7144EWCZ OTP ROM, 8KX8, 65ns, Bipolar, CDIP24, CERDIP-24 FUJITSU Semiconductor Limited CY7C263-55DMB vs MB7144EWCZ
R29791SM OTP ROM, 8KX8, 95ns, Bipolar, CDIP24, Raytheon Semiconductor CY7C263-55DMB vs R29791SM
AM27C49-35PCB OTP ROM, 8KX8, 35ns, CMOS, PDIP24, PLASTIC, DIP-24 AMD CY7C263-55DMB vs AM27C49-35PCB
27HC641-70I/P 8K X 8 OTPROM, 70 ns, PDIP24, PLASTIC, DIP-24 Microchip Technology Inc CY7C263-55DMB vs 27HC641-70I/P
27HC641-55/P 8K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24 Microchip Technology Inc CY7C263-55DMB vs 27HC641-55/P
CY7C263-45DC OTP ROM, 8KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 Cypress Semiconductor CY7C263-55DMB vs CY7C263-45DC
27HC641L-70/P 8K X 8 OTPROM, 70 ns, PDIP24, PLASTIC, DIP-24 Microchip Technology Inc CY7C263-55DMB vs 27HC641L-70/P

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