Memory
CY7C263-55WMB
Description: UVPROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24

Overview of CY7C263-55WMB by Cypress Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for CY7C263-55WMB by Cypress Semiconductor

Part # Manufacturer Description Stock Price Buy
DISTI # CY7C263-55WMB
Direct Components, Inc.   18
RFQ

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Part Data Attributes for CY7C263-55WMB by Cypress Semiconductor

CY7C263-55WMB
Cypress Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
WDIP, DIP24,.3
Pin Count
24
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
55 ns
Additional Feature
POWER SWITCHED PROM
I/O Type
COMMON
JESD-30 Code
R-GDIP-T24
JESD-609 Code
e0
Length
31.877 mm
Memory Density
65536 bit
Memory IC Type
UVPROM
Memory Width
8
Moisture Sensitivity Level
1
Number of Functions
1
Number of Terminals
24
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Standby Current-Max
0.03 A
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Want to compare parts?
  1. CY7C263-55WMB
    Cypress Semiconductor
    UVPROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24
    VS

Alternate Parts for CY7C263-55WMB

This table gives cross-reference parts and alternative options found for CY7C263-55WMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C263-55WMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
5962-8751512LA UVPROM, 8KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 QP Semiconductor CY7C263-55WMB vs 5962-8751512LA
WS57C49C-25D UVPROM, 8KX8, 25ns, Bipolar, CDIP24, 0.600 INCH, CERAMIC, DIP-24 Teledyne e2v CY7C263-55WMB vs WS57C49C-25D
H1264B-55D MASK ROM, 8KX8, 55ns, CMOS, CDIP24 Hughes Aircraft CY7C263-55WMB vs H1264B-55D
F356435S MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation CY7C263-55WMB vs F356435S
AT27HC641R-70DM UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Atmel Corporation CY7C263-55WMB vs AT27HC641R-70DM
HI1264B-D-000 MASK ROM, 8KX8, 35ns, CMOS, CDIP24 Hughes Aircraft CY7C263-55WMB vs HI1264B-D-000
WS57C49C-55DMB 8KX8 UVPROM, 55ns, CDIP24, 0.600 INCH, CERDIP-24 STMicroelectronics CY7C263-55WMB vs WS57C49C-55DMB
WS57C49C-45TMB 8KX8 UVPROM, 45ns, CDIP24, 0.300 INCH, CERDIP-24 STMicroelectronics CY7C263-55WMB vs WS57C49C-45TMB
AT27HC642R-70DM UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Atmel Corporation CY7C263-55WMB vs AT27HC642R-70DM
WS57C49B-70DMB UVPROM, 8KX8, 70ns, CMOS, CDIP24, Waferscale Integration Inc CY7C263-55WMB vs WS57C49B-70DMB

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