There are no models available for this part yet.
Overview of CYD18S18V18-200BBAXC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
CYD18S18V18-167BBAXC | Rochester Electronics LLC | 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | |
CYD18S18V18-167BBAXI | Rochester Electronics LLC | 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 |
CAD Models for CYD18S18V18-200BBAXC by Cypress Semiconductor
Part Data Attributes for CYD18S18V18-200BBAXC by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code
|
BGA
|
Package Description
|
17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256
|
Pin Count
|
256
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
3.3 ns
|
Additional Feature
|
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
|
Clock Frequency-Max (fCLK)
|
200 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
S-PBGA-B256
|
JESD-609 Code
|
e1
|
Length
|
17 mm
|
Memory Density
|
18874368 bit
|
Memory IC Type
|
MULTI-PORT SRAM
|
Memory Width
|
18
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Ports
|
2
|
Number of Terminals
|
256
|
Number of Words
|
1048576 words
|
Number of Words Code
|
1000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
1MX18
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA256,16X16,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.7 mm
|
Standby Current-Max
|
0.3 A
|
Standby Voltage-Min
|
1.4 V
|
Supply Current-Max
|
0.77 mA
|
Supply Voltage-Max (Vsup)
|
1.58 V
|
Supply Voltage-Min (Vsup)
|
1.42 V
|
Supply Voltage-Nom (Vsup)
|
1.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
Width
|
17 mm
|
Alternate Parts for CYD18S18V18-200BBAXC
This table gives cross-reference parts and alternative options found for CYD18S18V18-200BBAXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CYD18S18V18-200BBAXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CYD18S18V18-200BBAC | Dual-Port SRAM, 1MX18, 3.3ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 | Cypress Semiconductor | CYD18S18V18-200BBAXC vs CYD18S18V18-200BBAC |
CYD18S18V18-200BBAXI | Dual-Port SRAM, 1MX18, 3.3ns, CMOS, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | Cypress Semiconductor | CYD18S18V18-200BBAXC vs CYD18S18V18-200BBAXI |
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