Part Details for DE52B13-350 by LSI Corporation
Overview of DE52B13-350 by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for DE52B13-350
DE52B13-350 CAD Models
DE52B13-350 Part Data Attributes
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DE52B13-350
LSI Corporation
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Datasheet
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DE52B13-350
LSI Corporation
EEPROM, 2KX8, 350ns, Parallel, MOS, CDIP24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 350 ns | |
Additional Feature | 10000 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS | |
Command User Interface | NO | |
Data Polling | NO | |
Data Retention Time-Min | 10 | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | MOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Toggle Bit | NO |
Alternate Parts for DE52B13-350
This table gives cross-reference parts and alternative options found for DE52B13-350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DE52B13-350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
DQ52B13-350 | EEPROM, 2KX8, 350ns, Parallel, MOS, CDIP24 | LSI Corporation | DE52B13-350 vs DQ52B13-350 |
AT28C16F-35DM/883 | EEPROM, 2KX8, 350ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24 | Atmel Corporation | DE52B13-350 vs AT28C16F-35DM/883 |
X2816ADM-35 | EEPROM, 2KX8, 350ns, Parallel, NMOS, CDIP24, HERMETIC SEALED, CERDIP-24 | Xicor Inc | DE52B13-350 vs X2816ADM-35 |
XLE2816A-350P | EEPROM, 2KX8, 350ns, Parallel, NMOS, PDIP24, | Exel Microelectronics Inc | DE52B13-350 vs XLE2816A-350P |
XLS2816A-350P | EEPROM, 2KX8, 350ns, Parallel, NMOS, PDIP24, | Exel Microelectronics Inc | DE52B13-350 vs XLS2816A-350P |
XLE2816AP-350 | EEPROM, 2KX8, 350ns, Parallel, NMOS, PDIP24, | Exel Microelectronics Inc | DE52B13-350 vs XLE2816AP-350 |
AT28C16-35DC | EEPROM, 2KX8, 350ns, Parallel, CMOS, CDIP24 | Atmel Corporation | DE52B13-350 vs AT28C16-35DC |
X2816AD-35 | EEPROM, 2KX8, 350ns, Parallel, NMOS, CDIP24, HERMETIC SEALED, CERDIP-24 | Xicor Inc | DE52B13-350 vs X2816AD-35 |
DE52B13H-350 | EEPROM, 2KX8, 350ns, Parallel, MOS, CDIP24 | LSI Corporation | DE52B13-350 vs DE52B13H-350 |
X2816ADI-35 | EEPROM, 2KX8, 350ns, Parallel, NMOS, CDIP24, HERMETIC SEALED, CERDIP-24 | Xicor Inc | DE52B13-350 vs X2816ADI-35 |