Part Details for DH89209-BH200C by Temex Ceramics
Overview of DH89209-BH200C by Temex Ceramics
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for DH89209-BH200C
DH89209-BH200C CAD Models
DH89209-BH200C Part Data Attributes:
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DH89209-BH200C
Temex Ceramics
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Datasheet
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DH89209-BH200C
Temex Ceramics
Pin Diode, Silicon,
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEMEX COMPONENTS | |
Package Description | O-CRFM-F4 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Additional Feature | HIGH VOLTAGE | |
Application | SWITCHING | |
Case Connection | CATHODE | |
Configuration | SINGLE | |
Diode Capacitance-Max | 2.4 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 0.3 Ω | |
Diode Res Test Current | 300 mA | |
Diode Res Test Frequency | 120 MHz | |
Diode Type | PIN DIODE | |
Frequency Band | MEDIUM FREQUENCY TO VERY HIGH FREQUENCY | |
JESD-30 Code | O-CRFM-F4 | |
Minority Carrier Lifetime-Nom | 18 µs | |
Number of Elements | 1 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 175 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | ROUND | |
Package Style | FLANGE MOUNT | |
Power Dissipation-Max | 1 W | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Technology | NEGATIVE-INTRINSIC-POSITIVE | |
Terminal Form | FLAT | |
Terminal Position | RADIAL |