Part Details for DM355SZCE135 by Texas Instruments
Results Overview of DM355SZCE135 by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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DM355SZCE135 Information
DM355SZCE135 by Texas Instruments is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DM355SZCE135
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
DM355SZCE135-ND
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DigiKey | IC DGTL MEDIA PROCESSOR 337NFBGA Min Qty: 160 Container: Tray |
0 Tray |
|
$17.8011 | Buy Now |
|
|
Vyrian | Microprocessor Circuit, CMOS, PBGA337 | 9820 |
|
RFQ |
US Tariff Estimator: DM355SZCE135 by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
DM355SZCE135 Part Data Attributes
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DM355SZCE135
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
DM355SZCE135
Texas Instruments
DM355SZCE135
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | BGA | |
| Package Description | 13 X 13 Mm, 0.65 Mm Pitch, Rohs Compliant, Plastic, Bga-337 | |
| Pin Count | 337 | |
| HTS Code | 8542.31.00.30 | |
| Bit Size | 32 | |
| Format | Fixed Point | |
| JESD-30 Code | S-PBGA-B337 | |
| JESD-609 Code | e1 | |
| Length | 13 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 337 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | Plastic/Epoxy | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA337,19X19,25 | |
| Package Shape | Square | |
| Package Style | Grid Array, Low Profile, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 32768 | |
| Seated Height-Max | 1.3 Mm | |
| Supply Voltage-Max | 1.365 V | |
| Supply Voltage-Min | 1.235 V | |
| Supply Voltage-Nom | 1.3 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Other | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.65 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 Mm | |
| uPs/uCs/Peripheral ICs Type | Digital Media Soc |