Datasheets
DPE256S8N-30I by:

EEPROM Module, 256KX8, 300ns, Parallel, CMOS

Part Details for DPE256S8N-30I by B&B Electronics Manufacturing Company

Overview of DPE256S8N-30I by B&B Electronics Manufacturing Company

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Applications Industrial Automation Renewable Energy Robotics and Drones

Part Details for DPE256S8N-30I

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DPE256S8N-30I Part Data Attributes

DPE256S8N-30I B&B Electronics Manufacturing Company
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DPE256S8N-30I B&B Electronics Manufacturing Company EEPROM Module, 256KX8, 300ns, Parallel, CMOS
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP
Package Description DIP, DIP32,.6
Reach Compliance Code unknown
ECCN Code 3A991.B.1.B.1
HTS Code 8542.32.00.51
Access Time-Max 300 ns
Additional Feature DATA RETENTION > 10 YEARS
Data Polling YES
Data Retention Time-Min 10
JESD-30 Code R-XDMA-T32
JESD-609 Code e0
Memory Density 2097152 bit
Memory IC Type EEPROM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX8
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Page Size 128 words
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Standby Current-Max 0.0015 A
Supply Current-Max 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit NO

Alternate Parts for DPE256S8N-30I

This table gives cross-reference parts and alternative options found for DPE256S8N-30I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPE256S8N-30I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NM27C020Q100 256KX8 UVPROM, 100ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments DPE256S8N-30I vs NM27C020Q100
W49F002U-70BN 256KX8 FLASH 5V PROM, 70ns, PDIP32, PLASTIC, DIP-32 Winbond Electronics Corp DPE256S8N-30I vs W49F002U-70BN
NM27C020Q120 256KX8 UVPROM, 120ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments DPE256S8N-30I vs NM27C020Q120
CAT28F020PI-12 256KX8 FLASH 12V PROM, 120ns, PDIP32, PLASTIC, DIP-32 onsemi DPE256S8N-30I vs CAT28F020PI-12
HN62302BP-20 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd DPE256S8N-30I vs HN62302BP-20
AT27C020-12PK OTP ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation DPE256S8N-30I vs AT27C020-12PK
M29F002T-90XP1 256KX8 FLASH 5V PROM, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics DPE256S8N-30I vs M29F002T-90XP1
M29F002T-70XP6 256KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics DPE256S8N-30I vs M29F002T-70XP6
NM27C020QE150 256KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments DPE256S8N-30I vs NM27C020QE150
DPE256S8N-25I EEPROM Module, 256KX8, 250ns, Parallel, CMOS B&B Electronics Manufacturing Company DPE256S8N-30I vs DPE256S8N-25I

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