Part Details for EDI8F81027LP100B6I by White Electronic Designs Corp
Overview of EDI8F81027LP100B6I by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Security and Surveillance
Industrial Automation
Audio and Video Systems
Transportation and Logistics
Energy and Power Systems
Renewable Energy
Automotive
Robotics and Drones
Part Details for EDI8F81027LP100B6I
EDI8F81027LP100B6I CAD Models
EDI8F81027LP100B6I Part Data Attributes
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EDI8F81027LP100B6I
White Electronic Designs Corp
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Datasheet
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EDI8F81027LP100B6I
White Electronic Designs Corp
SRAM Module, 1MX8, 100ns, CMOS, DIP-32
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | DIP-32 | |
Reach Compliance Code | unknown | |
Access Time-Max | 100 ns | |
JESD-30 Code | R-XDMA-T32 | |
Memory Density | 8388608 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX8 | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for EDI8F81027LP100B6I
This table gives cross-reference parts and alternative options found for EDI8F81027LP100B6I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8F81027LP100B6I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
DPS1MS8MP-10C | SRAM Module, 1MX8, 100ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8MP-10C |
DPS1MS8EJ4-35CI | SRAM Module, 1MX8, 35ns, CMOS | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8EJ4-35CI |
DPS1MS8MP-15I | SRAM Module, 1MX8, 150ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8MP-15I |
DPS1MS8EJ4-25C | SRAM Module, 1MX8, 25ns, CMOS | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8EJ4-25C |
DPS1MS8EL4-30CI | SRAM Module, 1MX8, 30ns, CMOS | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8EL4-30CI |
DPS1MX8MKN3-45B | SRAM Module, 1MX8, 45ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MX8MKN3-45B |
DPS1MS8EL4-25C | SRAM Module, 1MX8, 25ns, CMOS | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8EL4-25C |
DPS1MS8EL4-45CI | SRAM Module, 1MX8, 45ns, CMOS | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8EL4-45CI |
EDI8F81027LP55B6C | SRAM Module, 1MX8, 55ns, CMOS, DIP-32 | White Electronic Designs Corp | EDI8F81027LP100B6I vs EDI8F81027LP55B6C |
DPS1MS8EJ4-45CI | SRAM Module, 1MX8, 45ns, CMOS | B&B Electronics Manufacturing Company | EDI8F81027LP100B6I vs DPS1MS8EJ4-45CI |