Datasheets
FSA221L10X by:
onsemi

Multimedia and USB 2.0 Hi-Speed and Audio Switches w/ Negative Signal Capability, 5000-REEL

Part Details for FSA221L10X by onsemi

Results Overview of FSA221L10X by onsemi

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Applications Education and Research Consumer Electronics Audio and Video Systems Aerospace and Defense Energy and Power Systems Renewable Energy Entertainment and Gaming Communication and Networking Automotive

FSA221L10X Information

FSA221L10X by onsemi is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Price & Stock for FSA221L10X

Part # Distributor Description Stock Price Buy
Rochester Electronics Multimedia and USB 2.0 Hi-Speed and Audio Switches w/ Negative Signal Capability RoHS: Compliant Status: Active Min Qty: 1 10000
  • 100 $0.6224
  • 500 $0.5602
  • 1,000 $0.5166
  • 10,000 $0.4606
  • 100,000 $0.3859
$0.3859 / $0.6224 Buy Now
Chip Stock FSA221e4ACTIVE(LastUpdated:2daysago)10-UFQFNExposedPadaudioIC1.6mm5V4Ohm1xDPDT 4960
RFQ

US Tariff Estimator: FSA221L10X by onsemi

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FSA221L10X
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Part Details for FSA221L10X

FSA221L10X CAD Models

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FSA221L10X Part Data Attributes

FSA221L10X onsemi
Buy Now Datasheet
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FSA221L10X onsemi Multimedia and USB 2.0 Hi-Speed and Audio Switches w/ Negative Signal Capability, 5000-REEL
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Package Description Vqccn, Lcc10,.06x.08,20
Manufacturer Package Code 523AZ
Reach Compliance Code Compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Analog IC - Other Type Dpdt
JESD-30 Code R-XQCC-N10
JESD-609 Code e4
Length 2.1 Mm
Moisture Sensitivity Level 1
Normal Position No/Nc
Number of Channels 2
Number of Functions 1
Number of Terminals 10
Off-state Isolation-Nom 37 Db
On-state Resistance Match-Nom 0.4 Ω
On-state Resistance-Max (Ron) 5 Ω
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Separate Output
Package Body Material Unspecified
Package Code VQCCN
Package Equivalence Code LCC10,.06X.08,20
Package Shape Rectangular
Package Style Chip Carrier, Very Thin Profile
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.55 Mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount Yes
Switch-off Time-Max 10000 Ns
Switch-on Time-Max 10000 Ns
Switching Break-Before-Make
Technology Cmos
Temperature Grade Industrial
Terminal Finish Nickel Palladium Gold
Terminal Form No Lead
Terminal Pitch 0.5 Mm
Terminal Position Quad
Time@Peak Reflow Temperature-Max (s) 30
Width 1.6 Mm
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FSA221L10X Related Parts

FSA221L10X Frequently Asked Questions (FAQ)

  • A good PCB layout for the FSA221L10X should minimize parasitic inductance and capacitance. Place the device close to the power source, use short and wide traces for power and ground, and avoid vias under the device. A 4-layer PCB with a solid ground plane is recommended.

  • Proper thermal management is crucial for the FSA221L10X. Ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pad. The thermal pad should be connected to a solid ground plane or a thermal relief pattern.

  • The maximum allowed voltage on the EN pin of the FSA221L10X is 6V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a resistor divider to ensure the EN pin voltage remains within the specified range.

  • The FSA221L10X is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's current handling capability and ensure proper thermal management when operating in high-temperature environments.

  • To troubleshoot issues with the FSA221L10X, check the input voltage, output current, and thermal management. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use a thermal camera or thermometer to check the device temperature. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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