Datasheets
GE28F128L18T85 by:

Flash, 8MX16, 90ns, PBGA56

Part Details for GE28F128L18T85 by Micron Technology Inc

Overview of GE28F128L18T85 by Micron Technology Inc

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Part Details for GE28F128L18T85

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GE28F128L18T85 Part Data Attributes

GE28F128L18T85 Micron Technology Inc
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GE28F128L18T85 Micron Technology Inc Flash, 8MX16, 90ns, PBGA56
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description FBGA, BGA56,7X8,30
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 90 ns
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B56
Memory Density 134217728 bit
Memory IC Type FLASH
Memory Width 16
Number of Sectors/Size 4,127
Number of Terminals 56
Number of Words 8388608 words
Number of Words Code 8000000
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Organization 8MX16
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA56,7X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Page Size 4 words
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Sector Size 16K,64K
Standby Current-Max 0.00007 A
Supply Current-Max 0.05 mA
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM
Toggle Bit NO
Type NOR TYPE

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